C-Series H-Pin Socket Accelerated life testing solution Burn-in sockets using H-Pin technology for high-reliability testing of next-generation IC packages Benefits C Series Socket is a modular burn-in socket with clamshell-style lid. The small footprint outline allows for a best-in-class range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board. Utilizing the H-Pin in the C-Series socket provides market leading electrical performance for all reliability testing requirements. The modularity provides unmatched design flexibility and ensures no sacrifices are made in delivering a complete solution without compromising performance or reliability. ■ Design flexibility, in-house tooling and molds allow for lowest cost of test. ■ Extensive catalog of standard components reduces cost and lead-time. ■ ≥0.3 pitch accommodates a wide variety of application needs. ■ Optimized thermal profile to end-use specification. LCC, QFP, QFN, LGA, BGA, and WLCSP Spring-loaded plunger Heat sink HAST venting features Integrated thermal control with heater and sensor Reverse seating plane Package inserts for a variety of sizes High temperature materials for abo

C-Series socket specifications Mechanical properties Electrical properties ■ Pitch: ≤0.35 mm ■ Package size: LGA: 0.5 mm to 12 mm BGA: 0.5 mm to 9 mm ■ Pin count: LGA: 625 BGA/QNF: 750 ■ Temperature: –55  to 260  ºC ºC ■ Contact resistance: 35 mΩ ■ Current carrying capacity: up to 4 A Materials ■ Contact: BeCu/Au plated ■ Spring: SS/Au plated ■ Socket: Engineering plastics C-Series socket dimensions Heat sink, heater, and RTD Spring-loaded plunger more > smithsinterconnect.com   Copyright© 2023 Smiths Interconnect | All rights reserved | Version 1.0 The information contained within this document...