Flexible and fast mobile storage, bringing the smart world to your fingertips The Best Solution for Smartphones and Automotive Competitive chip size 11x13mm and 1.0T(~1TB) High performance with optimized power consumption Features ·SK hynix’s UFS4.0 devices provide the highest performance with latest V7 4D NAND combined with next gen SoC ·Competitive Device Thickness UFS4.0 1TB – 1.0T ·SK hynix’s 1st Automotive 176 layer 4D TLC UFS3.1/2.1 with the fast speed, higher performance and reliability Chip size Model Name Technical Specification Interface Application Performance Sequential Read Sequential Write(WB) Feature Speed Operating Temp Applications Mobile UFS: Flexible and fast mobile storage, bringing the smart world to your fingertips http://product.skhynix.com www.linkedin.com/company/sk-hynix © 2023 SK hynix Inc. All Rights Reserved. Specifications and designs are subject to change without notice. All data were deemed correct at time of creation. SK hynix is not liable for errors or omissi
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