Multiplayer with DRAM and NAND Controller in One! Multi Chip Package (MCP) is the ultimate solution for mobile devices, combining UFS storage and LPDDR memory in a single area-efficient package that achieves high densities and ultra-fast speeds. An MCP can realize 40-50% space saving gains compared to discrete DRAM and NAND. This advantage continues to drive MCP adoption in high-density mobile storage, where the lineup of MCPs continue to fulfill a wide range of capacity and power requirements. 1 of 2 | MCP : Multiplayer with DRAM and NAND Controller in One! http://product.skhynix.com www.linkedin.com/company/sk-hynix

Product Details | MCP - UFS NAND and LPDDR DRAM stacked in a single package - Competitively thin form factor packing high densities with smaller footprint NAND mode NAND Density DRAM mode DRAM Density Package type Mobile Action Camera Wearable Devices 2 of 2 | MCP : Multiplayer with DRAM and NAND Controller in One! © 2023 SK hynix Inc. All Rights Reserved. Specifications and designs are subject to change without notice. All data were deemed correct at time of creation. SK hynix is not liable for errors or omissions. B-MCP-E01-230310-R02