MCP
MCP
The document discusses the Multi Chip Package (MCP) technology by SK hynix, which integrates UFS storage and LPDDR memory into a single, space-efficient package. This integration offers significant space savings of 40-50% compared to using discrete DRAM and NAND components, making it ideal for high-density mobile storage applications.
- MCP combines UFS NAND and LPDDR DRAM in a single package.
- Supports UFS3.1 and UFS2.2 for NAND mode, with densities up to 16GB.
- Supports LPDDR5 and LPDDR4X for DRAM mode, with densities up to 512GB.
- Speed capabilities include 6400Mbps for LPDDR5 and 4266Mbps for LPDDR4X.
- Package types include 254-ball for LPDDR4X + UFS2.2 and 297-ball for LPDDR5 + UFS3.1.
MCP technology is suitable for various devices, including mobile phones, tablets, wearable devices, and action cameras, due to its compact form factor and high-density capabilities.
All specifications and designs are subject to change without notice, and SK hynix is not liable for any errors or omissions in the data provided.
Catalog excerpts
Multiplayer with DRAM and NAND Controller in One! Multi Chip Package (MCP) is the ultimate solution for mobile devices, combining UFS storage and LPDDR memory in a single area-efficient package that achieves high densities and ultra-fast speeds. An MCP can realize 40-50% space saving gains compared to discrete DRAM and NAND. This advantage continues to drive MCP adoption in high-density mobile storage, where the lineup of MCPs continue to fulfill a wide range of capacity and power requirements. 1 of 2 | MCP : Multiplayer with DRAM and NAND Controller in One! http://product.skhynix.com www.linkedin.com/company/sk-hynix
Open the catalog to page 1
Product Details | MCP - UFS NAND and LPDDR DRAM stacked in a single package - Competitively thin form factor packing high densities with smaller footprint NAND mode NAND Density DRAM mode DRAM Density Package type Mobile Action Camera Wearable Devices 2 of 2 | MCP : Multiplayer with DRAM and NAND Controller in One! © 2023 SK hynix Inc. All Rights Reserved. Specifications and designs are subject to change without notice. All data were deemed correct at time of creation. SK hynix is not liable for errors or omissions. B-MCP-E01-230310-R02
Open the catalog to page 2All SK hynix catalogs and technical brochures
PC8012 Pages
eMMC2 Pages
UFS1 Page
CXL8 Pages
DDR5 RDIMMs2 Pages
DDR5 DIMM for Server2 Pages
DDR SDRAM Device Operation36 Pages
DDR2 SDRAM Device Operations62 Pages
DDR3L SDRAM Device Operation147 Pages
DDR4 SDRAM Device Operation266 Pages
NAND Flash10 Pages
Mobile Memory5 Pages
Graphics Memory5 Pages
Consumer Memory7 Pages
Computing Memory24 Pages
Product catalogue12 Pages
2013 Databook28 Pages
