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2013 Databook

2013 Databook
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2013 Databook

Product catalog summary
Overview: This technical databook from Q3 2013 provides detailed specifications for various DDR3 SDRAM components and modules, including DDR3, DDR3L, and DDR3L-RS solder-down components, as well as UBDIMM and RDIMM modules.
DDR3 SDRAM Components: The document outlines DDR3 SDRAM components with specifications such as a voltage of 1.5V, densities ranging from 2Gb to 8Gb, and speeds from DDR3 1066 to DDR3 1866. Key features include 8Bank, CL timings, and FBGA package types with 78 or 96 balls. Notable part numbers are H5TQ2G83EFR-RDC, H5TQ4G83AFR-RDC, and H5TQ8G83AMR-RDC.
DDR3L SDRAM Components: Operating at a lower voltage of 1.35V, these components have similar density and speed ranges as DDR3. Important part numbers include H5TC2G83CFR-PBA and H5TC4G83MFR-PBA, with availability mostly marked as 'Now' or Q1/Q2 2014.
DDR3L-RS SDRAM Components: These 1.35V components include part numbers like H5TC2G83CFR-PBR and H5TC4G83AFR-PBR, available immediately or in early 2014.
UBDIMM Modules: The document details UBDIMM modules for both 1.5V and 1.35V configurations, with densities from 2GB to 8GB. Modules are based on 512Mx8 or 256Mx8 components, with speeds from 1333 to 1866. Part numbers include HMT41GU6AFR8C-RD and HMT41GU7MFR8A-PB.
RDIMM Modules: RDIMM modules are available in 1.5V and 1.35V versions, with densities up to 32GB. These modules use 2Gx4 or 1Gx4 components, with speeds from 1066 to 1866. Key part numbers are HMT84GR7AMR4C-PB and HMT42GR7AFR4A-RD.
Mobile Memory (LPDDR2 & LPDDR3):
  • LPDDR2: Available in densities of 4Gb, 2Gb, and 1Gb with speeds from DDR2-667 to DDR2-1066, supporting 8 banks with voltage options of 1.8V/1.2V/1.2V.
  • LPDDR3: Available in 4Gb density with speeds of DDR3-1600 and DDR3-1333, packaged in FBGA with 8 banks and similar voltage options.
NAND Flash:
  • SLC: Offers products from 128Mb to 32Gb with varying block sizes and package types, including TSOP and FBGA, with voltage options of 3.3V and 1.8V.
  • MLC: Products range from 16Gb to 512Gb, with block sizes up to 4MB, available in TSOP and FBGA packages, supporting ONFi standards.
  • eMMC: Densities from 2GB to 64GB, using 2ynm and 1xnm technology, supporting MMC4.41 and MMC4.5 standards.
  • E2NAND3.0: Densities from 64Gb to 1024Gb, with block sizes of 2MB and 4MB, available in VLGA packages with voltage options of 3.0V and 3.3V.
CMOS Image Sensors:
  • VGA & HD: Sensors with optical formats from 1/10-inch to 1/9-inch, supporting frame rates up to 60 fps, with output formats including YUV and RGB.
  • 1.3M to 2M: Sensors with 1/6-inch to 1/5-inch optical formats, supporting 15 fps at full resolution, with output formats including YUV and RGB.
  • FHD to 8M: Sensors with optical formats from 1/6-inch to 1/4-inch, supporting frame rates up to 60 fps, with output formats including Bayer and YUV.
Conclusion: The document provides a comprehensive list of DDR3 memory components and modules, detailing their specifications, configurations, and availability, useful for computing memory applications.
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Catalog excerpts

2013 Databook-2

Computing Memory DDR3 SDRAM : Component PART NUMBER

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2013 Databook-3

Computing Memory DDR3 SDRAM : Component PART NUMBER

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2013 Databook-4

Computing Memory DDR3 SDRAM : Component PART NUMBER

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Computing Memory DDR3 SDRAM : Module PART NUMBER

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2013 Databook-6

Computing Memory DDR3 SDRAM : Module PART NUMBER

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2013 Databook-7

DDR3 SDRAM : Module SKTynix

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DDR3 SDRAM : Module SKTynix

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Computing Memory DDR3 SDRAM : Module PART NUMBER

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2013 Databook-10

Computing Memory DDR3 SDRAM : Module PART NUMBER

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2013 Databook-11

Computing Memory DDR3 SDRAM : Module LRDIMM MODULE PART NUMBER

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Computing Memory DDR3 SDRAM : Module PART NUMBER

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Consumer & Network Memory DDR3 SDRAM

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Consumer & Network Memory DDR3 SDRAM PART NUMBER

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Consumer & Network Memory DDR2 SDRAM PART NUMBER

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Graphics Memory GDDR5 SDRAM PART NUMBER PART NUMBER

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Graphics Memory DDR3 SDRAM PART NUMBER

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PART NUMBER (reduced page size) (reduced page size)

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PART NUMBER (reduced page size) (reduced page size) * All SDRAM is Available For Lead Free or Lead & Halogen Free

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2013 Databook-20

Mobile Memory LPSDR PART NUMBER (reduced page size) (reduced page size) (reduced page size) (reduced page size) * All SDRAM is Available For Lead Free or Lead & Halogen Free

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2013 Databook-21

PART NUMBER * All SDRAM is Available For Lead Free or Lead & Halogen Free PART NUMBER * All SDRAM is Available For Lead Free or Lead & Halogen Free

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NAND Flash eMMC Base Component Product Vcc/Org Tech.

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2013 Databook-26

CMOS Image Sensor Part Number Optical Format Pixel Size Active Array Format 30-fps @full resolution 60-fps @full resolution Frame Rate 30-fps @full resolution 30-fps @full resolution 30-fps @full resolution 30-fps @full resolution 30-fps @ 720P Digital Core Analog & Pixel Operating Temp. Mass Production Mass Production Mass Production Mass Production Output Format Supply Voltage Parallel / MIPI

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2013 Databook-27

CMOS Image Sensor Part Number Optical Format Pixel Size Active Array Format Frame Rate Digital Core Analog & Pixel Operating Temp. Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Recon. Wafer Recon. Wafer Parallel / MIPI Parallel / MIPI Output Format Supply Voltage Parallel / MIPI Parallel / MIPI

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2013 Databook-28

CMOS Image Sensor Part Number Optical Format Pixel Size Active Array Format Frame Rate 60-fps@full resolution 15-fps @full resolution 15-fps @full resolution 15-fps @full resolution 30-fps @full resolution 30-fps @full resolution Output Format Digital Core Analog & Pixel Operating Temp. Mass Production Mass Production Mass Production Mass Production Mass Production Recon. Wafer Recon. Wafer Recon. Wafer Recon. Wafer Recon. Wafer Parallel / MIPI Parallel / MIPI Parallel / MIPI Parallel / MIPI Parallel / MIPI Supply Voltage Parallel / MIPI

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All SK hynix catalogs and technical brochures

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  5. MCP

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  7. NAND Flash

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  8. Mobile Memory

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