Overview
The document describes the IndustrialBSP PICO, a laser marking and engraving system developed by SISMA S.p.A. It features a picosecond laser source, which is ideal for precise and clean markings due to its reduced thermal effect.

Picosecond Laser Source
This laser source generates pulses lasting only a few picoseconds with high peak intensities, enabling non-linear/multiphoton absorption. This results in minimal thermal effects, making it suitable for precise and clean markings without the need for reworking.

Compact System
The BSP PICO system is compact and robust, featuring a granite working plane that ensures process stability for pieces weighing up to 20 kg. It includes three motorized axes with a movement precision of 50 µm, a working area of 300 x 300 mm, and a Z-axis amplitude of 360 mm.

Advanced Software
The integrated software, developed by SISMA, facilitates file management and the marking process, even for complex tasks. It offers high customization to enhance operator efficiency.

Technical Specifications

• Active Material: Yb
• Average Power: 50 W
• Wavelength: 1030 nm
• Working Frequency: 50 ÷ 2000 kHz
• Pulse Duration: 0.001 - 0.003 ns
• Peak Power: 10000 kW
• Pulse Energy: 0.025 mJ
• Beam Quality (M²): < 1.4
• Cooling System: Water-based
• Axis Stroke (XYZ): 300 mm x 300 mm x 360 mm
• Max Piece Weight: 20 kg
• Axis Precision: 0.05 mm
• Axis Repeatability: 0.02 mm
• Power Supply: 230 V ± 15% 50/60 Hz, single phase
• Power Absorption: 1 kW
• Dimensions (L x D x H): 823 mm x 1329 mm x 1904 mm (2400 mm with open door)
• Weight: 590 kg