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Silicon Designs TB1010 Test Board for Model 1010 Accelerometers

Silicon Designs TB1010 Test Board for Model 1010 Accelerometers
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Silicon Designs TB1010 Test Board for Model 1010 Accelerometers

Product catalog summary
Overview: This document provides solder assembly tips for Silicon Designs' TB1010 and TB1210 models, focusing on the preferred methods and recommendations for soldering these components.
Preferred Soldering Method: The recommended method for assembling TB1010 or TB1210 is reflow using a hotplate. Sn62 or Sn63 type solder is advised for optimal results.
Hand Soldering: While possible, hand soldering is challenging due to the small size of connections. It is recommended to use a fine-tipped soldering iron and visual magnification. The J-Leaded version (1010J or 1210J) is suggested for easier inspection.
Pre-Tinning Recommendations: To prevent gold migration embrittlement, pre-tinning of accelerometer leads is advised. Avoid the solder bath method due to potential heat damage. Instead, tin one lead at a time using a fine-tipped solder iron.
Hotplate Attach Method: Apply solder paste or pre-tin the circuit board's pads. Place components in position and heat on a pre-heated hotplate at around 200°C until solder flows. Avoid overheating.
Solder Iron Attach Method with Solder Paste: Apply solder paste to the pads, position components, and secure by soldering opposite corner pads first. Ensure all connections are centered and allow cooling between soldering each pin.
Solder Iron Attach Method with Solder Wire: Pre-tin two opposite corner pads, position the accelerometer, and solder the tinned pads to secure. Proceed with soldering remaining connections, allowing cooling between each.
Contact Information: Silicon Designs, Inc., 1445-NW Mall Street, Issaquah, WA 98027-5344. Phone: (425)391-8329, Fax: (425)391-0446. Website: www.silicondesigns.com
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Catalog excerpts

Silicon Designs TB1010 Test Board for Model 1010 Accelerometers-1

771 SILICON DESIGNS, INC. Model TB1010 TEST BOARD for model 1010L & J Accelerometers M PARTS LIST QTY REFERENCE DESIGNATION PART NUMBER PART DESCRIPTION 1 - Model 1010L or 1010J Model 1010 Accelerometer (Sold Separately) 1 PCB1 100-00023-01 Printed Circuit Board 1 C1 753-00001-23 Capacitor, Surface Mount Chip, Size 1205,0.1 uF 1 H1 702-00001-10 Header, Right Angle, 2x5 Pins 0.75 PCB1 n4 n6 n8 r 0 |3 I |5 I |7 I 9 H1 H1 \s> \s> \s> \s> \S 0.10 0.10 HEADER SIGNAL SIGNAL PIN NAME DESCRITPION 1 DV Deflection Voltage input CM - (not used) 3 CLK Clock input 4 CNT Count output 5 DIR Direction output 6 VDD +5V Power 7 CLK/2 Clock+2 output 8 DIR Direction not output 9 - (not used) 10 GND Ground (6) +5VDC C1 11 |14 .1uF 16 (3) Clock; (1) Deflection Voltage^ VDD VR DIR >CLK DIR 1010x-xxx CNT DV GND CLK/2 Direction not | -> Direction (5) 12 10 -> Count (4) 15 ■> Clock-s-2 (7) 19 18 (10) Ground; Silicon Designs, Inc., 1445 NW Mail Street, Issaquah, WA 98027-5344 Phone: 425-391-8329 FAX: 425-391-0446 Seeour Web Site at: www.silicondesigns.comApr03

 Open the catalog to page 1
Silicon Designs TB1010 Test Board for Model 1010 Accelerometers-2

SILICON DESIGNS, INC TB1010 & TB1210 SOLDER ASSEMBLY TIPS Reflow using a hotplate is the preferred method for assembling the model TB1010 or TB1210 and Sn62 or Sn63 type solder is recommended. Hand soldering using a fine tipped soldering iron is possible but difficult without a steady hand and some form of visual magnification due to the small size of the connections. When using the hand solder iron method, it’s best to purchase the J-Leaded version (1010J or 1210J) for easier visual inspection of the finished solder joints. Pre-Tinning of Accelerometer Leads is Recommended: To prevent gold migration...

 Open the catalog to page 2

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