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SikaMelt®-601

SikaMelt®-601

SikaMelt®-601

Product catalog summary
Product Overview
SikaMelt®-601 is a polyurethane-based hot melt adhesive designed for textile lamination. It cures upon exposure to atmospheric moisture and is suitable for various textile applications, offering long open time, good initial strength, high final strength, flexibility, and excellent wash and cleaning resistance.

Specifications
  • Chemical Base: Polyurethane
  • Color: Transparent
  • Cure Mechanism: Moisture curing
  • Density: 1.2 kg/l
  • Viscosity at 130 °C: 10,000 mPa·s
  • Softening Temperature: 60 °C
  • Application Temperature: 100 – 140 °C (short term max. 1 h), 160 °C for nozzle
  • Curing Time: 14 hours
  • Green Strength: 0.02 MPa
  • Shelf Life: 9 months

Application Areas
SikaMelt®-601 is ideal for bonding foams and textiles, including non-polar polymers like PP and PE films after pre-treatment. It is recommended for professional users who should conduct tests to ensure compatibility.

Cure Mechanism
The adhesive cures by reacting with atmospheric moisture. Lower temperatures reduce curing speed, especially for hydrophobic or moisture-impermeable substrates. Adhesive layers should not exceed 100 µm for such materials.

Chemical Resistance
SikaMelt®-601 is resistant to aqueous surfactants, weak alkaline/acid solutions, and temporarily to fuels, solvents, and mineral oils. Testing is advised for chemical or thermal exposure.

Application Method
  • Surface Preparation: Surfaces must be clean, dry, and free from contaminants. Pre-treatment may be necessary.
  • Application: Can be applied as film, dot, bead, or spray. Use a filter system for automated applications. Adjust viscosity by changing application temperature.
  • Breaks: Lower heating to 80 °C for breaks ≥ 1 h, switch off for breaks ≥ 4 h. Protect adhesive in the melting tank with inert gases.

Storage Conditions
Store below 30 °C in a dry place. For transport, temperatures can exceed up to 60 °C for a maximum of 2 weeks.

Packaging Information
  • Cartridge: 330 g
  • Bag: 2 kg
  • Drum: 200 kg

Health and Safety
Refer to Safety Data Sheets for handling, storage, and disposal information.

Disclaimer
The information provided is based on current knowledge and experience. Users must test the product's suitability for their specific application. Sika reserves the right to change product properties.
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Catalog excerpts

SikaMelt®-601-1

PRODUCT DATA SHEET PRODUCT BENEFITS ■ Long open time ■ Good initial strength for textile lamination ■ High final strength and flexibility ■ Very good wash- and cleaning resistance ■ Broad adhesion spectrum DESCRIPTION SikaMelt®-601 is a versatile reactive hot melt adhesive based on polyurethane adhesive that cures on exposure to atmospheric humidity. SikaMelt®-601 is suitable for the lamination of various textiles. Moreover, it meets most common requirements for lamination applications in the textile industry. AREAS OF APPLICATION SikaMelt®-601 has a broad adhesion spectrum. It is suitable for permanent strong bonding of foams and textiles. Non polar polymers like PP and PE films can also be bonded after special pre-treatment. This product is suitable for experienced professional users only. Test with actual substrates and conditions have to be performed to ensure adhesion and material compatibility. TYPICAL PRODUCT DATA (FURTHER VALUES SEE SAFETY DATA SHEET) CQP = Corporate Quality Procedure A) Only valid for nozzle PRODUCT DATA SHEET SikaMelt®-601 Version 01.03 (05 - 2023), en_DEAUTO 013409606010001010

 Open the catalog to page 1
SikaMelt®-601-2

PACKAGING INFORMATION CURE MECHANISM SikaMelt®-601 cures by reaction with atmospheric moisture. At low temperatures the water content in the air is lower, which will result in a lower curing speed (see diagram 1). When bonding hydrophobic (e.g. PP) and/or moisture impermeable substrates a significantly longer curing time has to be taken into account. This applies especially on assembly applications with an adhesive thickness > 100 |am. For lamination applications of hydrophobic and/or moisture impermeable substrates the adhesive layer shall not exceed 100 |am. In such cases project related tests...

 Open the catalog to page 2

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