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SikaBlock® M150

SikaBlock® M150

SikaBlock® M150

Product catalog summary
Product Overview: SikaBlock® M150 is a model board used in the manufacture of substructures for design, styling, and clay models, as well as styling models and design studies. It is also suitable for test milling.
Physical Data: The board has a density of 0.15 g/cm³, flexural strength of 2.2 MPa, E-Modulus of 65 MPa, compressive strength of 1.6 MPa, and a linear thermal expansion coefficient of 65 x 10-6 K-1.
Processing Data: The product uses Biresin® Foam Adhesive and Biresin® Kleber orange, with mixing ratios of 100:65 and 100:2 respectively. Potlife ranges from 10 to 20 minutes, and setting time varies from 6 to over 20 minutes.
Product Benefits: SikaBlock® M150 features a dense, fine surface, is easily workable, produces low dust when milled, and has low thermal expansion.
Packaging: Available in various dimensions, with adhesives and fillers packaged separately. Board dimensions range from 2000 mm x 1000 mm x 100 mm to 2000 mm x 1000 mm x 400 mm.
Processing Instructions: Material should be acclimatized to 18-25°C before machining. It can be machined by sawing, milling, or drilling. Bonding areas must be clean and free of contaminants.
Storage: The product has an unlimited shelf life when stored flat and dry. Temperature variations during storage and transport should be moderate.
Health and Safety: Users should refer to the Safety Data Sheet for safe handling and storage information. Disposal must comply with regulations, and packaging should be recycled or disposed of as product waste.
Legal Notice: Information is based on Sika's current knowledge and experience. No warranty is implied, and users must test the product's suitability for their application. Sika reserves the right to change product properties.
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Catalog excerpts

SikaBlock® M150-1

Product Data Sheet Model board Manufacture of substructure for design, styling Manufacture of styling models and design studies Product Benefits Dense, fine surface Easily workable Low dust formation when milled Basis Hard polyurethane foam, light green Adhesive Biresin® Foam Adhesive, one-component-PUR-system Adhesive Biresin® Kleber orange, two-component-PUR-system Filler Biresin® Spachtel orange, two-component-polyester-system Board materials SikaBlock® M150 Adhesives Biresin® Foam Adhesive Biresin® Kleber orange, resin Filler Biresin® Spachtel orange, resin BPO-Paste, hardener other dimensions on request

 Open the catalog to page 1
SikaBlock® M150-2

■ The material must be acclimatised to 18 - 25°C prior to machining. ■ Machining of the block is easily accomplished by sawing, milling or drilling with machines or by hand. ■ For bondings use e. g. Biresin® Foam Adhesive or Biresin® Kleber orange (for more information see Product Data Sheet). Bonding areas must be clean, dry and free of dust and grease or oil. ■ For more information about milling please seek advice from cutting tool manufacturer or our separate ■ For correction or finishing of surface use Biresin® Spachtel orange (for more information see Product Data Sheet). ■ Product has un-limited...

 Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.