M1000g

M1000g

M1000g

Product catalog summary
Product Overview: SikaBlock® M1000 is a low-density tooling board designed for manufacturing true-to-size gauges, moulds, foundry models, and master models. It offers high dimensional stability, good edge stability, and a dense, high-tensile surface.
Physical Specifications: The product has a density of 1.0 g/cm³, Shore hardness of D 75, flexural strength of 48 MPa, E-Modulus of 1,800 MPa, compressive strength of 47 MPa at 10% strain, impact resistance of 13 kJ/m², heat distortion temperature of 85°C, and a thermal expansion coefficient of 55 x 10-6 K-1.
Processing Data: The recommended adhesives and fillers are Biresin® Power Adhesive Thix and Biresin® Spachtel weiß, with mixing ratios of 100:33 and 100:2 by weight, respectively. Pot life is 30 minutes for adhesive and 5 minutes for filler, with setting times of 16 hours and over 20 minutes.
Processing Instructions: Acclimatize material to 18-25°C before machining. Machining can be done using high-performance tools or by hand. Bonding areas must be clean and dry. For corrections, use Biresin® Spachtel weiß.
Health and Safety: Refer to the Safety Data Sheet for safe handling and storage information. Disposal should be in accordance with regulations, and packaging should be recycled if possible.
Storage: The product has an unlimited shelf life when stored flat in dry conditions. Temperature variations during storage and transport should be minimized.
Legal Notice: All technical data are based on laboratory tests. Users must test the product's suitability for their specific application. Sika reserves the right to change product properties.
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Catalog excerpts

M1000g-1

Product Data Sheet Version 07 / 2010 SikaBlock® M1000 Areas of Application Product Benefits Manufacture of true-to-size gauges and moulds Manufacture of foundry models and master models High dimensional stability and low density Low density for good handling Good edge stability Good heat distortion temperature Easily mechanically workable Dense, high-tensile surface Low thermal expansion coefficient Basis Adhesive Filler Polyurethane, white Biresin ® Power Adhesive Thix, two-component-epoxy-system Biresin ® Spachtel weiß, two-component-polyester-system, white Physical Data (approx. values) SikaBlock® M1000 Density Shore hardness Flexural strength Compressive strength Impact resistance Heat distortion temperature Coefficient of thermal expansion (CTE), αT Processing Data Adhesives / Filler Adhesive Biresin ® Power Mixing ratio Adhesive Thix Filler Biresin ® Spachtel Setting time Packaging Board materials Biresin® Power Adhesive Thix, AB Pack Biresin® Spachtel weiß, resin BPO-Paste, hardener 1500 mm x 500 mm x 50 mm, 25 pieces / pallet 1500 mm x 500 mm x 75 mm, 16 pieces / pallet 1500 mm x 500 mm x 100 mm, 12 pieces / pallet 6 x 0.9 kg net resin + 6 x 0.3 kg net hardener in a box 2 x 9.84 kg net cartridges 6 x 1.96 kg net tins in a box 2 x 0.16 kg net sticks (for cartridges) 6 x 0.04 kg net tubes in a box (for tins) SikaBlock® M1000 1 / 2 Tooling & Composites Tooling board of low density

 Open the catalog to page 1
M1000g-2

The material must be acclimatised to 18 - 25°C prior to machining. Machining of the block is easily accomplished by sawing, milling and so on with high performance tools or by hand. Bonding areas must be clean, dry and free of dust and grease or oil. For bondings use e. g. Biresin® Power Adhesive Thix (for more information see Product Data Sheet). For more information about milling please seek advice from cutting tool manufacturer or our separate leaflet. For correction or finishing of surface use Biresin ® Spachtel weiß (for more information see Product Data Sheet). Product has un-limited shelf...

 Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.