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FloTHERM® IC

FloTHERM® IC
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FloTHERM® IC Who Can Use FloTHERM IC? FloTHERM IC is designed to be used by all those involved in the thermal design and characterization of Semiconductor packages. How Does FloTHERM IC Save My Company Money? Mentor Graphics’ research reveals that a typical Semiconductor thermal group spends approximately 60% of its time on standard package thermal characterization and design and the rest on customer specific simulations. FloTHERM IC drastically reduces the time spent on standard package thermal characterization and design, and saves around 25% of the time spent on customer-specific work. To see the savings for your group use the Return-on-Investment calculator below. Beyond the financial benefits, FloTHERM IC also enhances the quality, reliability and availability of package thermal models by providing a fast, simple, proven, automated process, reducing the risk of modeling errors. FloTHERM IC ROI Calculator Typical Group Your Group Number of engineers in group (a) 3 Personnel cost per engineer, excluding overheads (b) $125,000 % time on std. characterization/design (c) 60 % time on customer-specific work [100-c] (d) 40 Saving on std. characterization/design [80%*a*b*c] $180,000 Saving on customer-specific work [25%*a*b*d] $37,500 Total Savings per year from FloTHERM IC $217,500 What is FloTHERM IC? FloTHERM IC is a new software product from Mentor Graphics that incorporates a high level of automation for key tasks related to Semiconductor thermal characterization and design. An intuitive wizard-driven user interface, interoperability with package-level EDA tools, and enterprise-level data scalability and portability are the other key features of FloTHERM IC. Built around FloTHERM® PACK, the wellestablished package smartpart technology, and the industry leader FloTHERM’s CFD solver technology, FloTHERM IC greatly boosts productivity of thermal analysis in the Semiconductor industry. FloTHERM IC vs. FloTHERM PACK FloTHERM IC builds upon the proven FloTHERM PACK technology of SmartParts but extends it much further. Here is a comparison of FloTHERM PACK and FloTHERM IC features: Features FloTHERM IC FloTHERM PACK Wizard-driven Interface Y Y Model Preview Y Y Detailed Models Y Y Compact Models Y Y JEDEC èJX/ØJX Metrics Y N CFD Solver Y N Batch Characterization Y N In-Built Design Parametrics Y N Interface with Cadence APD Y N Searchable Results Database Y N Libraries for Package Elements Y N Comparing FloTHERM IC with FloTHERMPACK Mentor Graphics Mechanical Analysis Division 300 Nickerson Road, Suite 200 Marlborough, MA 01752, USA Tel: +1 (508) 480 0881 Fax: +1 (508) 480 0882 info-mechanical@mentor.com Mentor Graphics Mechanical Analysis Division 81 Bridge Road, Hampton Court Surrey, KT8 9HH, UK Tel: +44(0)20 8487 3000 Fax: +44 (0)20 8487 3001 info-mechanical@mentor.com MECHANICAL ANALYSIS Electronics Thermal Please visit our website at: www.mentor.com/mechanical Copyright © 2010 Mentor Graphics Corp Mentor Graphics is a registered trademark of Mentor Graphics Corporation. All other trademarks mentioned in this document are trademarks of their respective owners

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power, die attach conductivity, lead pitch etc. on any JEDEC metric or compact model in just a few mouse clicks. • Searchable Results Database - Use the advanced Results Database to select the optimal starting point for a new package design from your previous solutions. • Libraries - Package constituents such as die, die attach, die attach pad, substrate, leadframe, lid etc. can be stored as separate library items, greatly speeding new package creation. • Continuous Update of Package Models - The range of supported packages is continuously updated to capture rapid advances in packaging...

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