R&D CLUSTER TOOL SAF
23Pages

Research and development works, feasibility studies and general academic work in the field of thin film technologies Sample manufacturing aimed at product prototyping for market evaluation of out-of-box technologies

Easy and simple tool control and maintenance Customized configuration and setup Wide spectrum of possible technological processes

TARGET CUSTOMERS Laboratories engaged or with the intentions of working to carry out research for thin film technologies Companies already working and possibly with production facilities with a desire or need to develop further the technology and to try to differentiate themselves from others Universities working or intending to work in the thin film area

DESIGN ADVANTAGES The cluster tool is a modular, expandable and flexible system Each chamber can operate independently due to individual pumping station, control and utility flange Deposition chambers and deposition sources are interchangeable due to identical design of the chambers and utility flanges All chambers can operate simultaneously

SAF CONFIGURATION THE CENTRAL CHAMBER IS EQUIPPED WITH 8 FLANGES FOR CHAMBERS OF YOUR CHOICE: Substrate loading/unloading and pre-treatment Substrate storage Deposition process chambers: Electron beam evaporation Thermal evaporation Thermal sublimation Magnetron sputtering Other deposition processes

OPTIONS Residual Gas Analysis/Mass Spectrometry Plasma Emission Monitoring

DELIVERY OPTIONS Any solo process chamber Cluster with the necessary process chambers Customized arrangement and instrumentation Additional chambers

®3iDnABE TECHNOLOGICAL KEY FEATURES Various substrates (metal, glass, plastic, ceramic), standard size 50x50x5 mm Substrate ion pretreatment Contact and contactless substrate heating/cooling Deposition of multi-layer coating stacks without tool venting Uniform coating due to rotatable substrate holder Debris-free coating due to upward deposition Base pressure -10-7 Torr Process control Blanked-off flanges on the process chambers allow attaching customized instrumentation and technological accessories

Substrate storage chamber - up to 6 samples Telescopic robotic arm 8 sealed mount flanges Detachable top lid 2 view ports Interior lighting Pumping system Vacuum gauges PREVENTS PROCESS CROSS-CONTAMINATION AND ENSURES SUBSTRATE TRANSFER WITHOUT VENTING OF THE CHAMBERS

SAMPLE STORAGE IN VACUUM OR INERT GAS ATMOSPHERE Two-level sample holder Optical sensor of sample presence CAN BE REPLACED BY ANY PROCESS CHAMBER

I ©5STANDARD UNITS FOR EACH DEPOSITION CHAMBER Quartz resonators (except for the magnetron sputtering chamber) Rotatable substrate holder Substrate shutter View port Interior lighting Pumping system Vacuum gauges Cooling/ heating water system Electrical and control system Hinged door

Circular source with cold cathode 2 filaments Process gasses Ar, O2 Stationary substrate holder Sensor of substrate presence Standard chamber equipment SUBSTRATE PRETREATMENT TO ENHANCE COATING ADHESION AND ENSURE STABILITY OF COATING PROPERTIES

Crucibles and boats (up to 4 pcs.) Substrate IR heating device (up to 200o C) Substrate temperature measurement Purge gas N2 Substrate masking Standard chamber equipment

Semiconductor wafers Solar cells Metallized foil

3 thermal sublimation cells Substrate contact heating/ cooling (-40..+60oC) Substrate and cells temperature measurement Purge gas N2 Substrate masking Standard chamber equipment [OLEDs, ORGANIC PHOTOVOLTAICS, HIGH-PURITY MATERIALS FOR ORGANIC ELECTRONICS

Organic solar cells Other organic electronics

©SiunASi MAGNETRON SPUTTERING CHAMBER MAGNETRON SPUTTERING IN METAL, QUASI-REACTIVE AND REACTIVE MODE Substrate IR heating up to 400o C Substrate temperature measurement 3 circular, planar magnetrons Available DC, pulsed DC, MF and RF power supply Twin, dual or single combination of magnetrons METAL, ALLOY, OXIDE, TCO, NITRIDE, CARBIDE, POLYMER, SEMI-CONDUCTOR AND P-l-N COATINGS

®SiDnASE MAGNETRON SPUTTERING CHAMBER MAGNETRON SPUTTERING IN METAL, QUASI-REACTIVE AND REACTIVE MODE Individual shutter for each magnetron Process gasses: Ar, H2, N2, O2 Changeable distance substrate to magnetron sources Changeable magnetron tilt according to the substrate Standard chamber equipment METAL, ALLOY, OXIDE, TCO, NITRIDE, CARBIDE, POLYMER, SEMI-CONDUCTOR AND P-l-N COATINGS

Solar cells Flexible circuit boards, electronics Decorative and protective coatings Antibacterial coatings And many other applications

TECHNICAL OUTLINE Dimensions (LxWxH) – 3x3x2m Weight – 2.8 t Installed power 50 kW Cooling water consumption 2.7 m3/

©5THE FULLY CUSTOMIZABLE CLUSTER TOOL THE BEST APPROACH TO NEW MATERIALS FOR DIFFERENT INDUSTRIES

CONTACTS Sidrabe, Inc. 17 Krustpils St. Riga, Latvia LV-1073 Phone: +371 67249806 Fax: +371 67139506 E-mail: sidrabe@sidrabe.eu