Catalog excerpts
Kleinstsicherungen / Sub-miniature Fuses Zeit / Strom-Kennlinien Time / current-characteristics Zeit/Strom-Kennlinien Time-Current Characteristics Aufbau / Construction Keramiksubstrat / ceramic substrate Schmelzleiter gedruckt / printed fuse-element Lötwärmebeständigkeit / resistance to soldering heat: (nach IEC 60068-2-58 / to IEC 60068-2-58) 260 °C, 10 s (Lötbad / solder bath) 260 °C, 10 s (reflow) Vibration / vibration: Isolationswiderstand / insulation resistance Schmelzzeitgrenzwerte / Fusing time limits 101 Bemessungsstrom Rated Current superflink very quick acting Kaltwiderstand Cold Resistance Schmelz- KennApprobationen integral zeichnung I²ts Value Marking Approvals Bemessungsstrom Rated Current BemessungsSpannungsAusschaltvermögen fall Rated Breaking Voltage Drop Capacity Abmessungen Dimensions Abk. Beschreibung Abbr. Description GT-1K 1.000 Stück gegurtet / 1.000 pieces on tape GT-5K 5.000 Stück gegurtet / 5.000 pieces on tape GT-10K 10.000 Stück gegurtet / 10.000 pieces on tape Empfohlene Anschlussflächen Recommended pad layout 18 © 2018-06 SIBA GmbH • www.siba.de
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