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STS-VCS

Product catalog summary

Overview: The document outlines the features and specifications of the Vacuum Climatic System provided by STS Test Solutions, located in Dongguan, Guangdong, China. The system is designed to be a leading choice for test chambers, offering advanced features and applications across various sectors.

Specifications: The system boasts a faster processing time of 3.5 hours compared to the traditional 8+ hours. It features laminar flow to reduce or eliminate particles and achieves an oxygen concentration of less than 10ppm after three pump and purge cycles. The system ensures a more complete cure with significantly less outgassing and consumes 1.6x to 2x less power and nitrogen. It also offers a much lower capital cost, being 2-3 times lower in CO2 emissions.

Technical Specifications: The system operates at temperatures ranging from ambient to 450°C, with an optional high-temperature version extending to 550°C. It maintains temperature uniformity within ± 5°C during dwell and features laminar gas flow parallel to the wafers. The pump and purge cycles are designed to reduce oxygen content effectively.

Main Features: The system includes vacuum processing with excellent pressure control, making it suitable for various applications such as polyimide/PBO cure, BCB bake, low-temperature polymer cure, copper anneal, and low-K dielectric cure.

Applications: The system is applicable in advanced packaging, CMOS image sensors, fan-out wafer-level packaging (FOWLP), semiconductor front-end anneal and degas, and RF devices.

Conclusion: The Vacuum Climatic System by STS Test Solutions offers a comprehensive solution for test chamber needs, with advanced features that enhance efficiency, reduce costs, and support a wide range of applications in the semiconductor and electronics sectors.

Catalog excerpts

Vacuum Climatic System To Become Your First Choice Test Chamber Provider

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Vacuum Climatic System Basic Technical Specifications Main Features Vacuum processing with excellent pressure control Operating temperature: ambient to 450°C (optional high temperature version: ambient to 550°C Temperature uniformity: ± 5°C during dwell Laminar gas ﬂow parallel to the wafers Pump and purge cycles to reduce O2: content Standard Configuration Faster process: 3.5 hours vs 8+ hours Laminar ﬂow reduces/eliminates particles Less than 10ppm O2: concentration after 3 pump and purge cycles More complete cure (5x less outgassing) 1.6x to 2x less power and N: consumption 6. Much lower capital...

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STS-VCS

STS-VCS

Catalog excerpts

All Shinewell Test Solutions Limited catalogs and technical brochures