Line 1: This line includes a dual-track printing machine (Honest A5-BTB), SPI (SINIC-TEK NOVA-D), multiple SMT machines (NPM-D3 series), reflow soldering (JT NS-1000II), and AOI (Jutze LI-3000DP). It supports components from 01005 to 120*90mm with a pitch of 0.2mm, and substrates from 50*50mm to 400*290mm. It can handle 272,000 components, suitable for mobile phones, motherboards, industrial control boards, laptops, high-density type boards, and graphics cards (0201). The dual track allows simultaneous operation of two different models.

Line 2: Equipped with a DESEN Classic-1008 printing machine, SINIC-TEK 8080 SPI, NPM-D3 and CM602 SMT machines, JT JTR-1203D-N reflow soldering, and JTA-320-M AOI. It supports components from 01005 to 100*90mm with a pitch of 0.2mm, and substrates from 50*50mm to 400*290mm. The capacity is 210,000 components, suitable for similar products as Line 1.

Line 3: Similar to Line 2, with identical equipment and capacity, supporting the same range of components and substrates.

Line 4: Features Honest A5 printing machine, SINIC-TEK 8080 SPI, NPM-D3 and CM602 SMT machines, JT NS-1000II reflow soldering, and JTA-320-M AOI. It supports components from 01005 to 100*90mm with a pitch of 0.2mm, and substrates from 50*50mm to 400*340mm. The capacity is 210,000 components, suitable for the same product types.

Line 5: Includes DESEN Classic-1008 printing machine, CM402L and CM602L SMT machines, JT NS-1000II reflow soldering, and JTA-320-M AOI. It supports components from 0201 to 100*90mm with a pitch of 0.2mm, and substrates from 50*50mm to 400*340mm. The capacity is 98,000 components, suitable for the same product types.

Total Capacity: The total capacity across all lines is 1,000,000 components, focusing on high-density and complex electronic boards.