HG007WS003

HG007WS003
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HG007WS003

Product catalog summary
Warranty
The supplier guarantees the product will meet specifications for 12 months from the shipping date. Defective products will be repaired or replaced if stored properly and used under specified conditions. After the warranty period, repairs or replacements will incur charges.
Features
The module features a small molecular organic light-emitting diode with a white color display, a resolution of 64x48, and a driver IC SSD1315. It offers a high contrast ratio of 2000:1, a wide viewing angle of 160 degrees, and supports multiple interfaces including 8-bit parallel and I2C. It operates in temperatures ranging from -40 to 70°C.
Mechanical Data
The module has a dot matrix of 64x48, with a dot size of 0.185 mm² and a panel size of 18.46x18.10 mm². The module thickness is 1.26 mm, and it weighs 0.84 grams.
Maximum Ratings
The supply voltage ranges are VDD: -0.3 to 4V, VBAT: -0.3 to 5V, and VCC: 6 to 15V. The operating temperature is -40 to 70°C, and the storage temperature is -40 to 80°C.
Electrical Characteristics
The logic supply voltage (VDD) ranges from 1.65 to 3.5V, and the charge pump regulator supply voltage (VBAT) ranges from 3.5 to 4.2V. The operating voltage for the OLED panel (VCC) is 7 to 7.5V.
Lifetime Specification
The module has a lifetime of 20,000 hours under specified conditions, with luminance decaying to less than 50% of the initial value.
Interface
The module includes a function block diagram, panel layout diagram, pin assignments, graphic display data RAM address map, and interface timing charts for various interfaces.
Power On/Off Sequence & Application Circuit
Detailed power on/off sequences are provided, along with application circuits for different interfaces including 8080 8-bit, 6800 8-bit, 4-wire SPI, and IIC interfaces.
Reliability Test Conditions
The module undergoes high and low-temperature operation and non-operation tests to ensure reliability.
Environmental Testing Procedures
  • High Humidity Operation: The device is tested at 65°C and 90% relative humidity for 120 hours.
  • Thermal Shock (Non-operation): The device undergoes cycles between -40°C and 80°C with specific timing for each temperature and transition.
  • Vibration: Tested at frequencies between 5-50Hz with a scan rate of 1 octave/min for 2 hours per axis.
  • Drop Test: The device is dropped from a height of 120cm, covering all angles, edges, and faces.
  • ESD (Non-operation): Air discharge model at ±8kV, repeated 10 times.
Test and Measurement Conditions
  • Measurements begin after temperature stability is achieved.
  • Polarizer degradation is ignored for certain tests.
  • Evaluation Criteria: Functionality must be intact, no observable defects, luminance should be more than 50% of the initial value, and current consumption should be within ±50% of the initial value.
Inspection and Quality Control
  • Sampling Method: Follows MIL-STD-1916 with different levels for major and minor defects.
  • Inspection Conditions: Conducted at 25±5°C, 50±10% RH, and pressure between 860-1060 hPa.
  • Defect Classification: Major defects include non-display, line defects, and glass cracks. Minor defects include scratches and stains.
  • Outgoing Specification: Specific criteria for defects like glass scratches and polarizer bubbles are outlined with acceptable quality levels (AQL).
Appendices
  • Definitions: Includes chromaticity coordinate, contrast ratio, response time, and viewing angle.
  • Measurement Apparatus: Lists equipment used for luminance, contrast, response time, and viewing angle analysis.
  • Precautions for Handling: Emphasizes ESD precautions, handling guidelines to avoid damage, and proper assembly techniques.
  • Electrical Precautions: Highlights the importance of adhering to specified voltage and current settings, power on/off procedures, and power-saving techniques.
Image Sticking Prevention Strategies:
  • Utilize image scrolling or animation to balance pixel usage and consider sleep mode to reduce residual images and extend power capacity.
  • Avoid using full white backgrounds to prevent prominent image sticking; black backgrounds are recommended for power savings and better visibility.
  • Prevent static high-brightness displays by using auto fadeout technology.
  • For static logos, alternate between the original and inverse patterns to equalize pixel usage.
Mechanical Precautions:
  • Use cushion or buffer tape on the panel to protect against damage from external forces.
  • Ensure adequate space for IC placement and use a conductive layer for EMI/EMC protection.
  • Avoid excessive bending of films; follow specified guidelines for bending areas.
Storage and Reliability Test Precautions:
  • Store OLED modules at 25°C±5°C and 55%±10%RH, away from direct sunlight or UV light, and use within six months of receipt.
  • Reliability is guaranteed only under specified test conditions and durations.
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Catalog excerpts

HG007WS003-1

SPECIFICATION FOR TFT LCD MODULECUSTOMER:CUSTOMER MODULE :_ HL MODEL : HG007WS003 □ Preliminary Specification ■Final Specification Customer Confirmation column: Approved by :Dept. :Data : Please return one of the copies of the specification with your signature to us within two weeks after you receive this document.If it is not returned,we will assume that you agree to the entire contents of this specification document.

 Open the catalog to page 1
HG007WS003-2

深圳市鸿光显示有限公司 REVISION RECORD REV. X01 A01 REVISION DESCRIPTION ■ INITIAL RELEASE ■ Add the package

 Open the catalog to page 2
HG007WS003-4

深圳市鸿光显示有限公司 1. WARRANTY Supplier warrants that the products delivered pursuant to this specification (or order) will conform to the agreed specifications for twelve (12) months from the shipping date ("Warranty Period"). Supplier is obligated to repair or replace the products which are found to be defective or inconsistent with the specifications during the Warranty Period without charge, on condition that the products are stored in the original packages at 25°C±5°C, 55%±10%RH or used as the conditions specified in the specifications. Nevertheless, Supplier is not obligated to repair or replace...

 Open the catalog to page 4
HG007WS003-5

深圳市鸿光显示有限公司 3. MECHANICAL DATA NO Aperture Rate Active Area Panel Size Module Size * Panel thickness includes substrate glass, cover glass and UV glue thickness.

 Open the catalog to page 5
HG007WS003-6

4. MAXIMUM RATINGS ITEM (1) Maximum ratings are those values beyond which damages to the OLED module may occur. The OLED functional operation should be restricted to the limits in the section 5. Electrical Characteristics tables. (2) The defined temperature ranges do not include the polarizer. The maximum withstood temperature of the polarizer should be 80°C.

 Open the catalog to page 6
HG007WS003-7

5.2 ELECTRO-OPTICAL CHARACTERISTICS PANEL ELECTRICAL SPECIFICATIONS (1) Normal mode condition : (Charge Pump) - VBAT = 3.6 V - Contrast setting : 0X7D - Charge Pump Setting:0x14 - Frame rate : 105Hz - Duty setting : 1/48 (2) Sleep mode condition : When send 0xae command OLED display off and memory data will be maintained. (3) Wake up condition : When send 0xaf command OLED will be turned on.

 Open the catalog to page 7
HG007WS003-8

6. LIFETIME SPECIFICATION ITEM Note: (A) Under VBAT = 3.6V (Charge Pump), Ta = 25°C, 50% RH. (B) Life time is defined the amount of time when the luminance has decayed to less than 50% of the initial measured luminance. (1) Setting of 110cd/m2: (Charge Pump) - Contrast setting : 0x7D - Charge Pump Setting:0x14 - Frame rate : 105Hz - Duty setting : 1/48

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HG007WS003-9

深圳市鸿光显示有限公司 7. INTERFACE 7.1 FUNCTION BLOCK DIAGRAM 7.2 PANEL LAYOUT DIAGRAM

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HG007WS003-10

Symbol Function NC. Reserved Pin (Supporting Pin) (GND) The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground. C2N Positive Terminal of the Flying Inverting Capacitor Negative Terminal of C2P the Flying Boost Capacitor The charge-pump capacitors are required C1P between the terminals. They must be floated when the converter is not C1N used. Power Supply for DC/DC Converter Circuit This is the power supply pin for the internal buffer of the DC/DC voltage VBAT converter. It must be connected to external source when the...

 Open the catalog to page 10
HG007WS003-12

7.4 GRAPHIC DISPLAY DATA RAM ADDRESS MAP The GDDRAM is a bit mapped static RAM holding the bit pattern to be displayed. The size of the RAM is 128 x 64 bits and the RAM is divided into eight pages, from PAGE0 to PAGE7, which are used for monochrome 128x64 dot matrix display, as shown in below figures. GDDRAM pages structure When one data byte is written into GDDRAM, all the rows image data of the same page of the current column are filled (i.e. the whole column (8 bits) pointed by the column address pointer is filled.). Data bit D0 is written into the top row, while data bit D7 is written into...

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HG007WS003-13

7.5 INTERFACE TIMING CHART Symbol 7.5.1 8080 8bits Serial Interface Timing Characteristics

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HG007WS003-14

7. 5.2 4-Wire Serial Interface Timing Characteristics

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HG007WS003-15

7.5.3 IIC Serial Interface Timing Characteristics , - Vss - 1.65V to 3.3V I!C Interface Timing Characteristics l2C interface Timing characteristics

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HG007WS003-16

深圳市鸿光显示有限公司 8. POWER ON / OFF SEQUENCE & APPLICATION CIRCUIT 8.1 POWER ON / OFF SEQUENCE Power ON sequence: 1.Power ON VDD 2.After VDD become stable, wait at least 20ms (t0), set RES# pin LOW (logic 3.low) for at least 3us (t1) (4) and then HIGH (logic high). After set RES# pin LOW (logic low), wait for at least 3us (t2). Then Power ON VCC. (1) 4. After VCC become stable, send command AFh for display ON. SEG/COM will be ON after 100ms (tAF). The Power ON Sequence Power OFF sequence: 1. Send command AEh for display OFF. 2. Power OFF VCC. (1), (2) 3. Power OFF VDD after tOFF. (4) (where Minimum...

 Open the catalog to page 16
HG007WS003-17

深圳市鸿光显示有限公司 Note: (1) VCC should be kept float (i.e. disable) when it is OFF. (2) Power Pins (VDD, VCC) can never be pulled to ground under any circumstance. (3) The register values are reset after t1. (4) VDD should not be Power OFF before VCC Power OFF. 8.2 APPLICATION CIRCUIT 8.2.1 This circuit is for 8080 8bits interface, Charge pump application. Recommended components: C5、C6:4.7uF/25V(Tantalum type) or VISHAY (572D475X0025A2T) C3、C4:1uF/16V(0603) C1、C2:1uF/16V(0603) R1:620Kohm 1%(0603) Note: Vbat is also can be set 3.3V and connect VDD together. For charge pump mode, VCC not need to connect...

 Open the catalog to page 17
HG007WS003-18

深圳市鸿光显示有限公司 8.2.2 This circuit is for 6800 8bits interface, Charge pump application. Note: Vbat is also can be set 3.3V and connect VDD together. For charge pump mode, VCC not need to connect external voltage supplier.

 Open the catalog to page 18
HG007WS003-19

8.2.3 This circuit is for 4 wire SPI interface, Charge pump application. D3 D4 P? D6 D7 IRCF VCOMH VCC VLSS Nf(GNiP) Note: Vbat is also can be set 3.3V and connect VDD together. For charge pump mode, VCC not need to connect external voltage supplier.

 Open the catalog to page 19
HG007WS003-20

深圳市鸿光显示有限公司 8.2.4 This circuit is for IIC interface, Charge pump application. Recommended components: C5、C6:4.7uF/25V(Tantalum type) or VISHAY (572D475X0025A2T) C3、C4:1uF/16V(0603) C1、C2:1uF/16V(0603) R2、R3:10K(0603) (Should be adjusted based on IIC waveform) R1:620Kohm 1%(0603) Note: Vbat is also can be set 3.3V and connect VDD together. For charge pump mode, VCC not need to connect external voltage supplier.

 Open the catalog to page 20

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