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Thermal Pad H1500

Thermal Pad H1500
1Pages

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H1500-RTM SeriesThermal Gap Pad HFC H1500-R is a new type of thermal pad with ultrahigh thermal conductivity and ultra-low thermal impedance. It is manufactured by an advanced arrangement technology that the high thermal conductivity fillers are uniformly and vertically aligned distributed in the polymer matrix, which can greatly increase the heat transfer efficiency. Meanwhile, the low filler loading also makes the material possess good mechanical properties and excellent thermal stability. It can be widely used in electronic fields with high requirement for heat dissipation, such as satellite, radar, large server, data processing center, mobile phone with high performance and so on. Character : • Softness, excellent compression rate • Low Thermal Impedance • Light weight • Working under low pressure • Excellent thermal stability property Application : • Military industry • radar • Large server • GPU and image processor • High frequency netcom equipment The series of products accord with standers of ROHS and HALOGEN. Storage conditions: Storage in the dark; Storage temperature: < 30 °C; Storage humidity: < 70%; The height of the stacking is not more than 7 layers and the total height is not more than 1m. Shelf life: Two years at storage conditions SHENZHEN HFC SHIELDING PRODUCTS CO.f LTD Add : C Building, Phoenix Third work area, Fu Yong town, Bao An District, Shenzhen, China TEL : 0755-27327249 FAX : 0755-27327247 The above data is provided by HFC laboratory, NET : www.emigasket.com the laboratory reserves the final interpretati

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Thermal Pad H1500 1Pages

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Thermal Pad H1500
1Pages