Thermal interface materials
24Pages

{{requestButtons}}

Catalog excerpts

Thermal interface materials - 1

SHENZHEN HFC SHIELDING PRODUCTS CO., LTD Thermal Interface Materials

Open the catalog to page 1
Thermal interface materials - 2

HFC is dedicated to innovate, develop, namufacture and market our proprietary thermal interface materials. We are experts in these fields with excellent trust from various customers, such as HITACHI, TOSHIBA, FOXCONN, FLEXTRONICS, HUAWEI, AGILENT, LENOVO and others (including several agents abroad) who prefer our services as well as our products. Our company has also obtained ISO9001, IECQ- Since established in 2003, HFC has been dedicating to providing customers with the best and latest technology in our products. This dedication stems from our deeply embedded idea-maximizing customer's...

Open the catalog to page 2
Thermal interface materials - 3

Laboratory Equipments H100 Series Thermally Conductive Silicone Sheet H150 Series Thermally Conductive Silicone Sheet P05 H200 Series Thermally Conductive Silicone Sheet H250 Series Thermally Conductive Silicone Sheet P07 H300 Series Thermally Conductive Silicone Sheet H350 Series Thermally Conductive Silicone Sheet P09 H400 Series Thermally Conductive Silicone Sheet Thermally Conductive Encapsulating & Potting Compound P11 Thermal grease Thermally Conductive Double Side Tape P13 Thermally Conductive Insulators r it; i J HGF Series of Thermally Conductive Graphite P16/17 for Efficient Heat...

Open the catalog to page 3
Thermal interface materials - 4

Laboratory Equipments

Open the catalog to page 4
Thermal interface materials - 5

Production Methods Manual Operation Line Features of products: low hardness, super soft, thermal conductivity is below 3.0W, the thickness is above 0.5mm, 200*400,200*600, excellent apperance Automatic Production Line Features of products: high conductive and adhensive, the thickness is above 0.5mm, 360x360 Assembly Line eatures of products: large capacity, rolls of production, the thickness is below 5mm Thermal Pad for LED, between Baseplate and Heat Sink Thermal Pad between the PCB and Radiator Shell Thermal Pad between Power Amplifier Tube and Heat Sink

Open the catalog to page 5
Thermal interface materials - 6

H100 Series Thermally Conductive Silicone Sheet • Soft, Excellent compression rate • 1 .OW/m.k Thermal conductivity Typical Applications: • Between cooler and Chassis or frame • High speed diskstoragedrive • Flate-panel display • LED Lighting, Power conversion • Swift conversion • Engine control unit • Memory module Thickness: Many types of thickness for option, from 0.2mm to 14mm areavailable Above data is copyrighted and elaborated by HFC

Open the catalog to page 6
Thermal interface materials - 7

H150 Series Thermally Conductive Silicone Sheet Soft, Excellent compression rate Typical Applications: Between cooler and Chassis or frame Swift conversion Flate-panel display Power conversion Thickness: Many types of thickness for option, from 0.2mm to 14mm are available Above data is copyrighted and elaborated by HFC

Open the catalog to page 7
Thermal interface materials - 8

H200 Series Thermally Conductive Silicone Sheet Working under low pressure Excellent dielectric protecties and heat resistance Typical Applications: Between cooler and Chassis or Frame High speed diskstorgedrive LCD Back Light Unit Memory module Laptop, desktop and netbook Telecom hardware Power conversion Engine Control Unit Thickness: Many types of thickness for option, from 0.3mm to 14mm areavailable Above data is copyrighted and elaborated by HFC

Open the catalog to page 8
Thermal interface materials - 9

H250 Series Thermally Conductive Silicone Sheet Low compression, low heat resistance Excellent Thermal Conductive Properties 2.5W/m.k Thermal Conductivity, Low Thermal Impedance Excellent dielectric protecties and heat resistance Typical Applications: Between cooler and chassis or frame Engine control unit Power conversion High speed diskstrogedrive LCD Back Light Unit Memory Module Laptop, desktop and netbook Telecom hardware Thickness: Many types of thickness for option, from 0.3mm to 14mm are available Above data is copyrighted and elaborated by HFC

Open the catalog to page 9
Thermal interface materials - 10

Thickness: Many types of thickness for option, from 0.5mm to 14mm are available Above data is copyrighted and elaborated by HFC

Open the catalog to page 10
Thermal interface materials - 11

H350 Series Thermally Conductive Silicone Sheet Low compression, low heat resistance Excellent Thermal Conductive Properties 3.5W/m.k Thermal Conductivity, Low Thermal Impedance Excellent dielectric protecties and heat resistance Typical Applications: Power conversion High speed diskstoragedrive Laptop, desktop, netbook Telecom hardware Thickness: Many types of thickness for option, from 0.5mm to 8mm are available Above data is copyrighted and elaborated by HFC

Open the catalog to page 11
Thermal interface materials - 12

H400 Series Thermally Conductive Silicone Sheet Working under low pressure Excellent Thermal Conductive Properties 4.0W/m.k Thermal Conductivity, Low Thermal Impedance Excellent dielectric protecties and heat resistance Typical Applications: Mobile electronic equipment Engine Control Unit Wireless Telecom hardware Thickness: Many types of thickness for option, from 0.5mm to 8mm are available Above data is copyrighted and elaborated by HFC

Open the catalog to page 12
Thermal interface materials - 13

Thermally Conductive Encapsulating & Potting Compound ^PS-Hfittii*®, qJWSffl^PC(Poly-carbonate), PP, ABS, PVC^*t?4S.^^*fi<J*Sc iifflT<&7 Kft#&, RPl^ftwr Thermally Conductive Encapsulating & Potting Compound that is composed of two components with low viscosity and inflaming retarding materials, can cure at both room temperature and high temperaturelthe latter can decrease the cure time). No by-product would be caused during the cure reaction of the compound which could be used in the surface of various materials such as PC(Poly-carbonate), PP. ABS, PVC and primary applications are...

Open the catalog to page 13
Thermal interface materials - 14

Thermal grease Thermal grease (HG series products) (also called thermal gel, thermal compound, thermal paste) that is usually composed of organic silicone (base material) and polyorganosiloxane compound and high thermally conductive metallic oxide, is a perfect thermal interface. It can apply to high heat components such as CPU and high power transitors by filling microscope air-gaps, and conduct heat from heat sink system to bring down components' temperature and raise effiency. High thermal conductivity High K-value, conduct heal fast, aid components' dissipation to raise effiency Good...

Open the catalog to page 14
Thermal interface materials - 15

Thermally Conductive Double Side Tape • High self-adhesiveness, increases with temperature Typical Applications High power supply Dimension: Rolls with width of 360mm. Can be custom-made by required All above data is copyrighted and elaborated by HFC.

Open the catalog to page 15

All Shenzhen HFC Co. catalogs and technical brochures

  1. HFC-A1000

    1 Pages

  2. HFC-A2000

    1 Pages

  3. HFC-A5000

    1 Pages

  4. HFC-A15000

    1 Pages

  5. HFC-A15000

    1 Pages

  6. HFC-A18000

    1 Pages

  7. HFC-A25000

    1 Pages

  8. Catalog

    28 Pages