HFC Thermally Conductive Encapsulating & Potting Compound
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Thermally Conductive Encapsulating & Potting Compound ^PS-Hfittii*®, qJWSffl^PC(Poly-carbonate), PP, ABS, PVC^*t?4S.^^*fi<J*Sc iifflT<&7 Kft#&, RPl^ftwr Thermally Conductive Encapsulating & Potting Compound that is composed of two components with low viscosity and inflaming retarding materials, can cure at both room temperature and high temperaturelthe latter can decrease the cure time). No by-product would be caused during the cure reaction of the compound which could be used in the surface of various materials such as PC(Poly-carbonate), PP. ABS, PVC and primary applications are electronic parts for heat conducting, insulating, waterproofing and inflaming retarding. It can achieve UL94V-0 and be RoHS compliant absolutely. • SSfW^^tt^DPfiiill • Excellent Conductivity and Flammability • iJS^'ftS? • Low viscosity, excellent levelling property • Bftf^jSSIfcrftflSflSW, taJtSttSf • Cured soft rubber-like materials with excellent impact resistance • BtJ&tS, SBiStt, • Good heat resistance, moisture resistance, cold resistance • ScSS, 8f%S, Stiffl ^fafot-f-k^jYJSttffi . Good chemical properties such as insulated, moistureproof, seismic • Pft4f73 3i resistance, corona resistance, antileakage • Excellent adhesive power Typical Applications Power Module, Electron Component deep section cure, especial for HID power module cure Cure of outdoor LED display screens Mechanical adhesive of TV, CRT, power, communication apparatus and electronic/electric components, and adhesive bonding of electronic components Adhesive sealing of metal, plastic, glass with requirement of inflaming retarding. m^-fcBUJn££7|^N& Technical Properties before/after Curing Ptt: arUtffiffigP^3cSiJSi3'fW|B]ifoJigiy5.#SliSiii; *Cure time/hardness/conductivity can be custom-made.

Dragon King Temple Fufeng Road gg*SJigS¥tXo Af+nnnft^#S:, '\±^m^?H All data are provided hy HFC laboratory. Since tho performance standards and specif cations are different for each product, please ask tor details from HFC. Users are solely responsible for making preliminary Tests TO eetermine the suitability of products for their intended rise. Statements concerning possible or suggested uses made herein many not be relied upon, or be construed, as a guaranty of no patent ntringement al over the world.HFC recommends checking each pertinent country s laws, regulations and rules in advance,...