SHENZHEN HFC ●PROFESSIONAL● CONCENTRATIVE●DEDICATED Thermal pad with ultra-low thermal resistance HCF-013V3 is a new type of ultrathin thermal pad with ultralow thermal resistance. The thermal pad is fabricated by combining high thermal conductive two-dimensional materials and silicone. We take advantage of an advanced technology to arrange the twodimensional materials in the polymer matrix in an orderly manner to form a good thermal conductive path, which greatly improves the heat conductive efficiency. It is especially suitable for 5G base stations, chips and other equipment that need high heat flux. In -Product picture- addition, the ultra-thin thermal pad has many advantages ,such as high resilience, high compressibility, low density, excellent stability , etc., which can be used as a potential alternative materials of thermal grease. ● Ultral low thermal resistance pressure Test Method ● Being able to work under low ● high resilience ratio with sticky on the surface or without Standard size Thickness range ● Data processing center Resilience ratio Creep properties This series of products are environmentally compliant with RoHS Tensile Strength ● low density ● Excellent thermal stability property APPLICATIONS: 2.0, halogen, and REACH standards. Operating Temperature Front view All above data are copyrighted and elaborated by HFC

SHENZHEN HFC ●PROFESSIONAL● CONCENTRATIVE●DEDICATED Thermal pad with ultra-low thermal resistance Performance test and methods Test method Test items Thermal resistance ASTM D 5470Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials -Devices photos- Thermal resistance and compression ratio under different pressures. Test sample Test sample Thickness after compression（mm） 0.194 0.187 Test sample Test pressure(psi) All above data are copyrighted and elaborated by HFC

SHENZHEN HFC ●PROFESSIONAL● CONCENTRATIVE●DEDICATED Thermal pad with ultra-low thermal resistance Test sample Test sample Thermal Resistance (℃.cm²/W) Compression Ratio(%) Note; 1. HCF-013V3 is for GPU/CPU application . 2. At 10-30psi compression, The above table of thermal performance is for reference only. 3. HCF-013V3 can be with 2U adhesive film on both sides, It is slightly sticky after coated 2U adhesive film.and the thermal resistance test temperature is higher than 75℃,which the performance is close to the test value in the above table. All above data are copyrighted and elaborated by...

SHENZHEN HFC ●PROFESSIONAL● CONCENTRATIVE●DEDICATED Thermal pad with ultra-low thermal resistance Table 3 Static pressure test result(N) Compression Stress （N） Static pressure test result T=0.25mm T=0.3mm Tolerance; Width/Length：+/-0.3mm （Overall size） Thickness: 0.2mm, +0.03/-0.02mm. 0.25mm,+/-0.03mm. 0.3mm, +/-0.03mm. 0.4 mm, +/-0.04mm. 0.5mm, +/-0.05mm. Sealing edge width : 0.5+0.1/-0.3mm. Operation Methods ; 1. The product can be used for automatic assembly, 2.According to the requirements of customers, cooperate with customers to design simple fixtures. 3.The below operation method is for...

SHENZHEN HFC ●PROFESSIONAL● CONCENTRATIVE●DEDICATED Thermal pad with ultra-low thermal resistance Packing ; 1. Packing method： Packing with PE bags or Plastic box then with carton box. 2. According to the quantity of product packed in PE bag or Plastic box, It can also be customized according to customer requirements. above is the packing photos only for reference- Other ; 1. In order to achieve the best pasting effect, the surface of the pasted object must be kept clean. 2. Store at normal temperature and avoid direct sunlight. It is valid for 2 years under the condition of 28 ± 5. ℃ and 65%...