GR533x Developer Guide
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Version: 1.3 Release Date: 2024-09-18 Shenzhen Goodix Technology Co., Ltd.

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GODDiX Preface This document introduces the Software Development Kit (SDK) of the Goodix GR533x Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) and Keil for program development and debugging, to help you quickly get started with secondary development of Bluetooth LE applications. This document is intended for: • Device user • Test engineer • Technical support engineer This document is the fourth release of GR533x Developer Guide, corresponding to GR533x SDK. Revision History Copyright © 2024 Shenzhen Goodix Technology Co., Ltd. I

GODDiX Contents Copyright © 2024 Shenzhen Goodix Technology Co., Ltd. II

Copyright © 2024 Shenzhen Goodix Technology Co., Ltd.

GODDiX Introduction The Goodix GR533x series is a System-on-Chip (SoC) that supports Bluetooth 5.3 and Bluetooth Mesh, making it an ideal choice for applications including Internet of Things (IoT). Based on 64 MHz ARM Cortex -M4F CPU core, the GR533x series integrates a 2.4 GHz RF transceiver, Bluetooth LE 5.3 Protocol Stack, on-chip 512 KB Flash, 64 KB/96 KB system SRAM, and multiple peripherals. It provides outstanding RF performance, with a maximum TX power of +15 dBm, an RX sensitivity of -99 dBm in Bluetooth LE 1 Mbps mode, achieving an overall link budget of up to 114 dB. The GR533x...

GQDDiX Introduction Bluetooth LE Protocol Stack Generic Attribute Profile (GATT) Generic Access Profile (GAP) Attribute Protocol (ATT) Security Manager (SM) Logical Link Control and Adaptation Protocol (L2CAP) Host Controller Interface (HCI) Figure 1-1 Bluetooth LE Stack architecture The Bluetooth LE Stack consists of the Controller, the Host Controller Interface (HCI), and the Host. • Physical Layer (PHY): Supports 1 Mbps, 2 Mbps, 500 kbps, and 125 kbps adaptive frequency hopping and Gaussian Frequency Shift Keying (GFSK). • Link Layer (LL): Controls the RF state of devices. Devices are in...

GODDiX Introduction • Generic Access Profile (GAP): Provides upper-layer applications and profiles with interfaces to communicate and interact with protocol stacks, fulfilling functionalities such as advertising, scanning, connection initiation, service discovery, connection parameter update, secure process initiation, and response. • Attribute Protocol (ATT): Defines service data interaction protocols between a server and a client. • Generic Attribute Profile (GATT): Based on the top of ATT, it defines a series of communication procedures for upper-layer applications, profiles, and...

GODDiX GR533x Bluetooth LE Software Platform GODDiX GR533x Bluetooth LE Software Platform 2 GR533x Bluetooth LE Software Platform The GR533x SDK is designed for GR533x SoCs, to help users develop Bluetooth LE applications. It integrates Bluetooth LE 5.3 APIs, System APIs, and peripheral driver APIs, with various example projects and instruction documents for Bluetooth and peripheral applications. Application developers are able to quickly develop and iterate products based on example projects in the GR533x SDK. The GR533x hardware architecture is shown as follows. Bluetooth Subsystem...

GR533x Bluetooth LE Software Platform Power Management Unit (PMU): It supplies power for system modules, and sets reasonable parameters for modules, including DC-DC, SYS_LDO, IO-LDO, CORE_LDO, and RF Subsystem, based on configuration parameters and the current operating state of the system, so that the power can be managed automatically. Tip: For more details about device modules, refer to GR533x Datasheet . 2.2 Software Architecture The software architecture of GR533x SDK is shown below. Software Mesh Model Mesh Stack Hardware Bluetooth 5.3 Core Figure 2-2 GR533x software architecture...

GODDiX GR533x Bluetooth LE Software Platform Low Layer (LL) drivers which control and manage peripherals by registers Hardware Abstraction Layer (HAL) drivers; the HAL Driver layer is between the APP Driver layer and the LL Driver layer. HAL drivers offer a set of standard APIs, to allow the APP driver layer to access the LL peripheral resources by calling HAL APIs. Generally, HAL APIs are used for developing LL drivers and system services, not for developing common applications. Therefore, it is not recommended for developers to directly call HAL APIs. SDK that provides easy-to-use Mesh...

GODDiX GR533x Bluetooth LE Software Platform OxFFFF FFFF Peripheral BitBanding ExFlash Alias EFUSECTRL EFUSE ARRAY DMA GPIO1 GPIO0 PAD_CTRL DVS MCU_AUX(SNS-ADC eg.) CACHE-XQSPI HTABLE_AMCM PWM1 PWM0 UART1 UART0 I2C1 I2C0 SPI_S SPI_M AO N_GPIO AON RF AON PMU AON WD TIMER AON CLDR AON SLP TIMER AO N_PWR AON CTRL WATCHDOG DUAL_TIMER TIMER1 TIMER0 Figure 2-3 GR533x memory mapping • RAM: 96 KB in total; 0x0010_0000 to 0x0011_7FFF, or 0x2000_0000 to 0x2001_7FFF. For GR5330 SoCs, 64 KB in total; 0x0010_0000 to 0x0010_FFFF, or 0x2000_0000 to 0x2000_FFFF. ◦ 0x2000_0000 to 0x2001_7FFF: Variables of...

GR533x Bluetooth LE Software Platform 0x2001_3FFF, mapping to the region from 0x2200_0000 to 0x2227_FFFF, in which atomic operations are supported. ◦ 0x0010_0000 to 0x0011_7FFF: This region features higher access efficiency thanks to the Cortex®-M4F architecture. Therefore, executable code RAM_CODE is in this area. Flash: Internal Flash of GR533x SoCs is 512 KB, from 0x0020_0000 to 0x0027_FFFF. 2.4 Flash Memory Mapping GR533x packages an on-chip erasable Flash memory, which supports XQSPI bus interface. This Flash memory physically consists of several 4 KB Flash sectors; it can be logically...