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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive

Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive
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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive

Product catalog summary
Overview
Hot melt adhesives are solid adhesives that become liquid upon heating. They are classified based on raw materials, with polyurethane being a reactive type that undergoes chemical cross-linking after cooling. Rubber-based pressure-sensitive hot melt adhesives are used in packaging and labeling.

Types and Applications
  • Reactive Polyurethane Hot Melt Adhesives: Suitable for bonding various substrates, including difficult plastics. They offer high-speed processing, large gap filling, and rapid initial strength.
  • Pressure-Sensitive Hot Melt Adhesives: Known for long-lasting stickiness and self-adhesive properties, suitable for labels and metal back stickers.

Advantages
  • Reactive Polyurethane: Solvent-free, durable, resistant to moisture, chemicals, oil, and temperature.
  • Pressure-Sensitive: High initial adhesion, excellent aging resistance, and suitable for low-temperature applications.

Product Lines
  • Reactive Polyurethane: Includes products like DM-6596, DM-6542, and DM-6577, each with specific curing times and bonding strengths.
  • Pressure-Sensitive Rubber Base: Products like DM-6588 and DM-6589 are designed for labels and back stick applications, offering high adhesion and temperature resistance.

Technical Specifications
Products vary in viscosity, dispensing temperature, and softening points, tailored for specific applications and environmental conditions.

About DeepMaterial
DeepMaterial specializes in adhesives for semiconductor and electronic applications. The company focuses on developing innovative adhesive solutions, including EB curing adhesives, to meet high-precision bonding and protection needs in various industries.

Contact Information:
Email: [email protected]
Phone: +86-13352636504
Address: 7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park, Longhua District, Shenzhen, Guangdong, China
Website: www.deepmaterialcn.com
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Catalog excerpts

Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-1

Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive Hot melt adhesives exist in solid form and are classified by different types of raw materials. Polyurethane (Polyurethane Hot Melt Adhesive) is a reactive type of hot melt adhesive for the base material. After cooling, there will be a chemical cross-linking reaction. Rubber-based pressure-sensitive hot melt adhesives are mainly used in packaging, labels ,metal back stickers and so on. Reactive types of hot melt adhesives can bond a variety of substrates, including some difficult-to-bond plastics. These adhesives can handle all walks of life’s toughest bonding applications. The hot melt adhesives is the best choose of high-speed processing, bonding diversity, large gap filling, rapid initial strength and less shrinkage. DeepMaterial reactive types of hot melt adhesives have many advantages: the open time ranges from seconds to minutes, did’t need the fixtures, long-term durability and excellent moisture resistance, chemical resistance, oil resistance and temperature resistance. DeepMaterial’s reactive types of hot melt adhesive products are solvent-free. DeepMaterial Main Advantages of Hot Melt Adhesive Advantages of hot melt adhesive: ·High production efficiency (shorter curing time) ·Easy to realize the automate the process ·Combines adhesive and sealant properties Advantages of pressure sensitive hot melt adhesive: ·Long-lasting stickiness ·Self-adhesive coating ·Coating and assembly can be separated Advantages of reactive polyurethane hot melt adhesive: ·Low application temperature ·Long opening hours ·

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-2

Temperature Resistance Hot melt adhesives of different systems have different temperature resistance ranges. Bonding Different Substrates Different systems of hot melt adhesives have different adhesion to polar or non-polar substrates, and are suitable for bonding different substrates. Such as various plastics, metal and wood and paper. Chemical Resistance Different systems of hot melt adhesives have different resistance to chemical media. Bonding Strength Thermoplastic hot melt adhesives can gain ultimate strength immediately after cooling. They soften again when the temperature rises. Moisture-curing...

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-3

Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive Product Series Product Category Product Name Application Characteristics It is a fast curing reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture curing system. The material can be heated and solidified immediately, allowing processing without the need for thermal curing. It has good adhesion to common engineering plastics such as glass, aluminum, stainless steel and polycarbonate. Product Line It is a reactive hot melt adhesive based on polyurethane prepolymer....

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-4

Fast curing, high modulus, ultra-high initial adhesion, high polarity material bonding. Low viscosity, fast curing. Fast curing, low modulus, super high initial adhesion. Fast curing, high modulus, ultra-high initial adhesion, high polarity material bonding. Ultra-low viscosity, short open time, can be used for LCM side edge sealant. Ultra-low viscosity, short opening time, can be used on the side of the camera round light. Low viscosity, suitable for bonding with extremely narrow frame. Double curing Easy to repair, fast curing, high elongation, low hardness. Reactive polyurethane Easy to repair,...

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-5

Pressure-Sensitive Type Rubber-Based Hot Melt Adhesive Product Selection Product Line Product Series Product Category Suitable for all kinds of low temperature applications above -25°C, easy to die cutting, excellent viscosity at room temperature, can be used for cold storage labels High initial tack, high stickiness, excellent resistance to plasticization, used in film labels High adhesion, cold flow pressure sensitive adhesive, can be applied to tire labels Back stick type Suitable for all kinds of low temperature applications above -10°C, easy to die cutting, excellent viscosity at room temperature,...

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-6

It is a reactive black polyurethane hot melt adhesive, cured with moisture. This material is pressure sensitive and provides instant high initial strength after connecting parts. It has good basic bonding performance and the opening time suitable for automatic or manual assembly line production. DeepMaterial Data Sheet of Reactive Type and Pressure Type Sensitive Hot Melt Adhesive Product Line

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Reactive Type of Hot Melt Adhesive Product Data Sheet

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-8

Reactive Type of Hot Melt Adhesive Product Data SheetContinued Pressure Sensitive Type of Hot Melt Adhesive Product Data Sheet Pressure sensitive rubber base Product Category Label class Product Line Light yellow to amber Light yellow to amber Light yellow to amber Product Name Softe ning Point

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-9

Light yellow to amber Light yellow to amber Light yellow to amber Light yellow to amber

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive-10

About Us DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhe-sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film...

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