Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive
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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 1

Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive Hot melt adhesives exist in solid form and are classified by different types of raw materials. Polyurethane (Polyurethane Hot Melt Adhesive) is a reactive type of hot melt adhesive for the base material. After cooling, there will be a chemical cross-linking reaction. Rubber-based pressure-sensitive hot melt adhesives are mainly used in packaging, labels ,metal back stickers and so on. Reactive types of hot melt adhesives can bond a variety of substrates, including some difficult-to-bond plastics. These adhesives can handle all walks of life’s toughest bonding applications. The hot melt adhesives is the best choose of high-speed processing, bonding diversity, large gap filling, rapid initial strength and less shrinkage. DeepMaterial reactive types of hot melt adhesives have many advantages: the open time ranges from seconds to minutes, did’t need the fixtures, long-term durability and excellent moisture resistance, chemical resistance, oil resistance and temperature resistance. DeepMaterial’s reactive types of hot melt adhesive products are solvent-free. DeepMaterial Main Advantages of Hot Melt Adhesive Advantages of hot melt adhesive: ·High production efficiency (shorter curing time) ·Easy to realize the automate the process ·Combines adhesive and sealant properties Advantages of pressure sensitive hot melt adhesive: ·Long-lasting stickiness ·Self-adhesive coating ·Coating and assembly can be separated Advantages of reactive polyurethane hot melt adhesive: ·Low application temperature ·Long opening hours ·

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 2

Temperature Resistance Hot melt adhesives of different systems have different temperature resistance ranges. Bonding Different Substrates Different systems of hot melt adhesives have different adhesion to polar or non-polar substrates, and are suitable for bonding different substrates. Such as various plastics, metal and wood and paper. Chemical Resistance Different systems of hot melt adhesives have different resistance to chemical media. Bonding Strength Thermoplastic hot melt adhesives can gain ultimate strength immediately after cooling. They soften again when the temperature rises....

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 3

Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive Product Series Product Category Product Name Application Characteristics It is a fast curing reactive hot melt adhesive and sealant. It is a 100% solid, one-component material with a secondary moisture curing system. The material can be heated and solidified immediately, allowing processing without the need for thermal curing. It has good adhesion to common engineering plastics such as glass, aluminum, stainless steel and polycarbonate. Product Line It is a reactive hot melt adhesive based on polyurethane...

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 4

Fast curing, high modulus, ultra-high initial adhesion, high polarity material bonding. Low viscosity, fast curing. Fast curing, low modulus, super high initial adhesion. Fast curing, high modulus, ultra-high initial adhesion, high polarity material bonding. Ultra-low viscosity, short open time, can be used for LCM side edge sealant. Ultra-low viscosity, short opening time, can be used on the side of the camera round light. Low viscosity, suitable for bonding with extremely narrow frame. Double curing Easy to repair, fast curing, high elongation, low hardness. Reactive polyurethane Easy to...

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 5

Pressure-Sensitive Type Rubber-Based Hot Melt Adhesive Product Selection Product Line Product Series Product Category Suitable for all kinds of low temperature applications above -25°C, easy to die cutting, excellent viscosity at room temperature, can be used for cold storage labels High initial tack, high stickiness, excellent resistance to plasticization, used in film labels High adhesion, cold flow pressure sensitive adhesive, can be applied to tire labels Back stick type Suitable for all kinds of low temperature applications above -10°C, easy to die cutting, excellent viscosity at room...

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 6

It is a reactive black polyurethane hot melt adhesive, cured with moisture. This material is pressure sensitive and provides instant high initial strength after connecting parts. It has good basic bonding performance and the opening time suitable for automatic or manual assembly line production. DeepMaterial Data Sheet of Reactive Type and Pressure Type Sensitive Hot Melt Adhesive Product Line

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 7

Reactive Type of Hot Melt Adhesive Product Data Sheet

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 8

Reactive Type of Hot Melt Adhesive Product Data SheetContinued Pressure Sensitive Type of Hot Melt Adhesive Product Data Sheet Pressure sensitive rubber base Product Category Label class Product Line Light yellow to amber Light yellow to amber Light yellow to amber Product Name Softe ning Point

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 9

Light yellow to amber Light yellow to amber Light yellow to amber Light yellow to amber

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Reactive Type of Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive - 10

About Us DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhe-sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and...

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