Catalogs >
Shenzhen DeepMaterial Technologies Co., Ltd >
Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Adhesive

Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Adhesive
3Pages

Catalog excerpts

Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Adhesive - 1

Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Adhesive Underfill epoxy is a substance that fills in the gaps between the boards. It is applied to the surface of the board and then brushed over to fill in any gaps. There are two types of underfill epoxy: liquid and solid. Liquid underfill epoxy is applied with a brush or roller, which is then allowed to dry before it can be sanded down. Solid underfill epoxy can be used for structural purposes, but it cannot be used for cosmetic purposes. Epoxy is a type of glue that is used to seal and fill gaps. It can be used to fill gaps in wood, metal, or plastics. The glue is applied in liquid form and then it hardens when it comes into contact with the air. Underfill epoxy is a type of epoxy that has been specifically designed for use in automotive applications. It can be used to fill small gaps and voids that are found on the inside of a car's body panels, such as the door jamb. The underfill epoxy should not be confused with regular epoxy because it has different properties and requires different application methods.

Open the catalog to page 1

Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Adhesive - 2

Uses of Epoxy Epoxy is a type of glue that has a consistency that is thicker than paint and thinner than cement. It is used to fill joints in wood, to seal cracks in concrete, and to glue surfaces together. Epoxy can be used as underfill for PCBs. This prevents the PCB from being exposed to the air which can cause corrosion and other problems. The epoxy also provides insulation for the PCB so it does not get too hot or too cold depending on the environment it's in. Epoxy is a type of glue that is used to bind two pieces of material together. Underfill epoxy is a type of epoxy that is used...

Open the catalog to page 2

Low Temperature Cure BGA Flip Chip Underfill PCB Epoxy Adhesive - 3

Underfill epoxy is a type of epoxy that fills the gap between an automobile’s underbody and its body panels. It also prevents corrosion from forming on metal surfaces and helps to dissipate heat from the engine bay.

Open the catalog to page 3