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Epoxy Based Conductive Silver Adhesive

Epoxy Based Conductive Silver Adhesive

Epoxy Based Conductive Silver Adhesive

Product catalog summary
Overview: DeepMaterial's conductive silver adhesive is a one-component modified epoxy/silicone adhesive designed for integrated circuit packaging, LED light sources, and flexible circuit board industries. It offers high electrical conductivity, heat conduction, and temperature resistance, making it suitable for high-speed dispensing and various packaging applications.
Product Selection:
  • DM-7110: Used for IC chip bonding with short sticking time and minimal adhesive use, reducing costs and waste. Suitable for automatic dispensing.
  • DM-7130: Ideal for LED chip bonding, offering low dead light rate and high yield. It minimizes adhesive use and improves production cycles.
  • DM-7180: Designed for heat-sensitive applications requiring low-temperature curing, suitable for IC chip bonding with efficient adhesive use.
Product Data Sheet:
  • DM-7110: Silver color, viscosity of 10000 cps, cures at 175°C in 60 minutes, with a volume resistivity of <2.0×10-4 Ω.cm.
  • DM-7130: Silver color, viscosity of 12000 cps, cures at 175°C in 60 minutes, with a volume resistivity of <5.0×10-5 Ω.cm.
  • DM-7180: Silver color, viscosity of 8000 cps, cures at 80°C in 60 minutes, with a volume resistivity of <8.0×10-5 Ω.cm.
About DeepMaterial: DeepMaterial (Shenzhen) Co., Ltd. specializes in adhesives for semiconductor and electronic applications. The company focuses on developing adhesives for chip packaging, circuit boards, and electronic products, as well as protective films and semiconductor fillers. Their strategic plan includes the development of EB curing adhesives and new semiconductor materials to overcome current technological limitations and achieve advancements in adhesive applications.
Contact Information: Email: [email protected], Phone: +86-13352636504, Address: 7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park, Longhua District, Shenzhen, Guangdong, China. Website: www.deepmaterialcn.com
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Catalog excerpts

Epoxy Based Conductive Silver Adhesive-1

Epoxy Based Conductive Silver Adhesive DeepMaterial Conductive silver adhesive is a one-component modified epoxy/silicone adhesive developed for the integrated circuit packaging and LED new light sources, flexible circuit board (FPC) industries. After curing, the product has high electric conductivity, heat conduction, high temperature resistance and other high reliable perfor- mance. The product is suitable for high-speed dispensing, dispensing good type protection, no deformation, no collapse, no diffusion; The cured material is resistant to moisture, heat and high temperature. Can be used for crystal packaging, chip packaging, LED solid crystal bonding, low temperature welding, FPC shielding and other purposes. Conductive Silver Adhesive Product Selection Product line Product Name Product Typical Application Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle. Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent adhesive output speed, and improves production cycle time. When used in the LED packaging industry, the dead light rate is low, the yield rate is high, the light decay is good, and the degumming rate is extremely low. Conductive Silver Adhesive

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Epoxy Based Conductive Silver Adhesive-2

Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle. Conductive Silver Adhesive Product Data Sheet Epoxy based Product Series Conductive Silver Adhesive Product Colour Name Curing Time Curing Method Volume Resistivi...

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Epoxy Based Conductive Silver Adhesive-3

About Us DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhe-sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film...

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