Epoxy-Based Chip Underfill And COB Encapsulation Materials
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Epoxy-Based Chip Underfill And COB Encapsulation Materials DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, voidfree underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. DeepMaterial provides formulations for fast filling of very fine pitch parts, fast cure capability, long working and lifespan, as well as the reworkability. Reworkability saves costs by allowing removal of the underfill for reuse of the board. Flip chip assembly requires stress relief of the welding seam again for extended thermal aging and cycle life. CSP or BGA assembly requires the use of an underfill to improve the mechanical integrity of the assembly during flex, vibration or drop testing. DeepMaterial’s flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler levels, selected for the glass transition temperature and modulus for the intended application. COB encapsulant can be used for wire bonding to provide environmental protection and increase mechanical strength. The protective sealing of wire-bonded chips includes top encapsulation, cofferdam, and gap filling. Adhe- sives with fine-tuning flow function are required, because their flow ability must ensure that the wires are encapsulat- ed, and the adhesive will not flow out of the chip, and ensure that can be used for very fine pitch leads. DeepMaterial’s COB encapsulating adhesives can be thermally or UV cured DeepMaterial’s COB encapsulation adhesive can be heat cured or UV-cured with high reliability and low thermal swelling coefficient, as well as high glass conversion temperatures and low ion content. DeepMaterial’s COB encapsulating adhesives protect leads and plumbum, chrome and silicon wafers from the external environment, mechanical damage and corrosion. DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy, UV-curing acrylic, or silicone chemistries for good electrical insulation. DeepMaterial COB encapsulating adhesives offer go

temperature stability and thermal shock resistance, electrical insulating properties over a wide temperature range, and low shrinkage, low stress, and chemical resistance when cured. Deepmaterial is best top waterproof structural adhesive glue for plastic to metal and glass manufacturer,supply non conductive epoxy adhesive sealant glue for underfill pcb electronic components,semiconductor adhesives for electronic assembly,low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material and so on DeepMaterial Epoxy Resin Base Chip Bottom Filling And Cob Packaging...

Low Temperature Curing Epoxy Adhesive Product Selection Product Series Product name Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product is suitable for low-temperature curing and can have good adhesion to various materials in a relatively short time. Typical applications include memory cards, CCD/CMOS components. It is especially suitable for the occasions where the heat-sensitive element needs to be cured at a low temperature. It is a one-component thermal curing epoxy resin. This product is suitable for low-temperature curing and...

Heat curing Heat curing Heat curing Underfill Epoxy Product Selection Product Series Product name Product typical application It is a one-component, thermosetting epoxy resin. It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA. It is a fast...

DeepMaterial Epoxy Based Chip Underfill And COB Packaging Material Data Sheet Low Temperature Curing Epoxy Adhesive Product Data Sheet Product Product line Series Product Name Initial fixation time / full fixation Curing method Heat curing Heat curing Heat curing Epoxy based Low temperature curing encapsulant Heat curing Encapsulated Epoxy Adhesive Product Data Sheet Initial fixation time / full fixation Curing method Product Series Product Name Heat curing Epoxy based Encapsul ation Adhesive Heat curing

Heat curing Heat curing Underfill Epoxy Adhesive Product Data Sheet Produ ct line Product Series Product Name Initial fixation time / full fixation Curing method Heat curing Heat curing Epoxy based Opaque creamy yellow liquid Black liquid Heat curing Black liquid Heat curing Black liquid Heat curing Heat curing

About Us DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhe-sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and...