Wafer mapping film thickness measurement unit It can be visualized film thickness onto silicon wafer easily ! Automatic film thickness mapping measurement of up to 300 mm wafer is possible Automatic alignment function Automatic calibration function Improved measurement reliability in the wafer surface by adopting a wafer chuck with high flatness Supports automation High-precision measurement is realized by automatic detection function of notch orientation flat position and automatic detection function of wafer eccentricity. It is unnecessary to prepare calibration wafer by equipped with silicon port and dark port inside of device. It can be connected with pick-up robot as automatic wafer handling. Load port installation(Option) Example of measurement data Thickness of silicon of the bonding wafer (nm) contour plot Thickness of silicon of the bonding wafer (nm) 3D film thickness distribution It enables to install with existing semiconductor process machine load port by modifying FOUP shape machine cover. It enables to add film thinkess measurement device easily sustaining with existing device in terms of cleaness keeping.

Specification Item Installation type Target substarte 100 mm, 125 mm, 150 mm, 200 mm, 300 mm Wafer with film Light source Selectable below 3 kinds ・Deuterium Halogen lamp ・Halogen lamp ・White color LED Meaurement distance Beam spot About 3 mmø (Option 1 mmø, but in case, it enables to do alignment) Film thickness range ≦ 0.1 nm Curve fitting method FFT method Peak detection method ≦1 sec/point USB 2.0 Cable ・For data input ・For Stage control Notebook PC Main Body Automatic stage part Notebook PC Main body Automatic stage part Measurement time Data transfer Main body Stage part 100-240 VAC Max...