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DEPOSITION FILMS 1. Substrate material: PET, PEN, PES, PI, PC, PA, TAC… Films 2. Substrate thickness: 15~300μm 3. Deposition methods: AC Reactive for SiO2(Dielectric); Pulsed DC for ITO (Metal & Conductor) 4. Oxide conductor TCO: ITO, AZO, IZO… 5. Metal conductor: Al, Cu, Mo, Ag… 6. Optical film: Ta2O5, Nb2O5, SiO2, TiO2… 7. Semiconductor: ZnO, InGaZnO… 8. Insulator: SiO2, SiNx, AlOx, AlNx… 9. Uniformity: ±5% Across Web

Key Features A. One chamber divided into multi-pressure zones to accommodate various deposition sources. B. Multi-Source simultaneous deposition capabilities in one web pass, for multi-layer coating. C. Reversible web winding direction enables deposition of unlimited layers without breaking vacuum. D. Precision web handling mechanisms with edge-guide to allow multiple passes without loss of alignment. (Optional) E. AC Invert web drive system for accurate control of multiple web speeds. F. In-line optical and/or resistance thickness monitoring systems, to control precise deposition thickness and...

Technical Specifications Vacum chamber body: single chamber multi-pressure zones Moveable carriages: Web Carriage Deposion Zone: 2 X Sputtering Zone (Optional: 3 Sputtering Zone) Sputtering Source: 2 X Dual Cathode Sputter Source (Optional: 3 Dual Cathode Sputter Source) Substrate Pre-treater: Linear Ion Source Web Width: 1300mm Winding Diameter: Φ600mm Max Winding Direction: Bi-directional Substrate thickness: 15~300μm Web Line Speed:0.5~10M/min Web Tension: 5.0PLI Max 0.5PLI Min Web Alignment: ±3mm (one pass) Hi-Vacuum Pump: Turbo Pump Rough Vacuum Pump: Dry pump & Blower combination Moisture...