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Shanghai Royal Technology Inc.
Royal Technology Magnetron Sputtering Deposition Machine RTSP1300-R2R

Royal Technology Magnetron Sputtering Deposition Machine RTSP1300-R2R

Product catalog summary

Applications: The document outlines various applications for deposition films, including electronic paper, flexible circuits, photovoltaic cells, medical strips, RFID, Low-E film, and ITO thin film coatings. For more applications, a free consultation is offered.

Deposition Films Specifications:

Substrate Material: PET, PEN, PES, PI, PC, PA, TAC films.
Substrate Thickness: Ranges from 15 to 300μm.
Deposition Methods: AC Reactive for SiO2 (Dielectric) and Pulsed DC for ITO (Metal & Conductor).
Oxide Conductor TCO: Includes ITO, AZO, IZO.
Metal Conductor: Options include Al, Cu, Mo, Ag.
Optical Film: Ta2O5, Nb2O5, SiO2, TiO2.
Semiconductor: ZnO, InGaZnO.
Insulator: SiO2, SiNx, AlOx, AlNx.
Uniformity: ±5% across the web.

Key Features:

Chamber divided into multi-pressure zones for various deposition sources.
Multi-source simultaneous deposition for multi-layer coating in one web pass.
Reversible web winding direction for unlimited layers without breaking vacuum.
Precision web handling with edge-guide for multiple passes without alignment loss (optional).
AC Invert web drive system for accurate control of web speeds.
In-line optical and/or resistance thickness monitoring systems for precise deposition control (optional).
Chamber constructed of SUS304L Stainless with low outgassing components for deeper vacuum.
Vacuum pumping combines turbo-molecular pump and low temperature cryogenics for clean vacuum.

Technical Specifications:

Vacuum Chamber Body: Single chamber with multi-pressure zones.
Moveable Carriages: Web Carriage.
Deposition Zone: 2 X Sputtering Zone (Optional: 3 Sputtering Zone).
Sputtering Source: 2 X Dual Cathode Sputter Source (Optional: 3 Dual Cathode Sputter Source).
Substrate Pre-treater: Linear Ion Source.
Web Width: 1300mm.
Winding Diameter: Φ600mm Max.
Winding Direction: Bi-directional.
Substrate Thickness: 15~300μm.
Web Line Speed: 0.5~10M/min.
Web Tension: 5.0PLI Max, 0.5PLI Min.
Web Alignment: ±3mm (one pass).
Hi-Vacuum Pump: Turbo Pump.
Rough Vacuum Pump: Dry pump & Blower combination.
Moisture Pump: Polycold Cryogenic.
Deposition Thickness Control: Monitoring (Optional) with Transmit Optical and Eddy Current Resistance.
System Operation: PLC Based Computer System Operation.

Catalog excerpts

Royal Technology Magnetron Sputtering Deposition Machine RTSP1300-R2R-2

u Electronic paper u Flexible circuits, Photovoltaic u Medical strips, u RFID (Radio Frequency Identification) u Low-E film u ITO thin film coatings More applications, please contact us for a free consult!

Open the catalog to page 2

Royal Technology Magnetron Sputtering Deposition Machine RTSP1300-R2R-3

DEPOSITION FILMS 1. Substrate material: PET, PEN, PES, PI, PC, PA, TAC… Films 2. Substrate thickness: 15~300μm 3. Deposition methods: AC Reactive for SiO2(Dielectric); Pulsed DC for ITO (Metal & Conductor) 4. Oxide conductor TCO: ITO, AZO, IZO… 5. Metal conductor: Al, Cu, Mo, Ag… 6. Optical film: Ta2O5, Nb2O5, SiO2, TiO2… 7. Semiconductor: ZnO, InGaZnO… 8. Insulator: SiO2, SiNx, AlOx, AlNx… 9. Uniformity: ±5% Across Web

Open the catalog to page 3

Royal Technology Magnetron Sputtering Deposition Machine RTSP1300-R2R-4

Key Features A. One chamber divided into multi-pressure zones to accommodate various deposition sources. B. Multi-Source simultaneous deposition capabilities in one web pass, for multi-layer coating. C. Reversible web winding direction enables deposition of unlimited layers without breaking vacuum. D. Precision web handling mechanisms with edge-guide to allow multiple passes without loss of alignment. (Optional) E. AC Invert web drive system for accurate control of multiple web speeds. F. In-line optical and/or resistance thickness monitoring systems, to control precise deposition thickness and...

Open the catalog to page 4

Royal Technology Magnetron Sputtering Deposition Machine RTSP1300-R2R-5

Technical Specifications Vacum chamber body: single chamber multi-pressure zones Moveable carriages: Web Carriage Deposion Zone: 2 X Sputtering Zone (Optional: 3 Sputtering Zone) Sputtering Source: 2 X Dual Cathode Sputter Source (Optional: 3 Dual Cathode Sputter Source) Substrate Pre-treater: Linear Ion Source Web Width: 1300mm Winding Diameter: Φ600mm Max Winding Direction: Bi-directional Substrate thickness: 15~300μm Web Line Speed:0.5~10M/min Web Tension: 5.0PLI Max 0.5PLI Min Web Alignment: ±3mm (one pass) Hi-Vacuum Pump: Turbo Pump Rough Vacuum Pump: Dry pump & Blower combination Moisture...

Open the catalog to page 5

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