Technology Background The RTSP1200-PCB machine is a tailor-designed and fabricated equipment for PCBs plating by magnetron sputtering deposition technology. Everyone who is involved with the PCB industry knows that PCBs which have copper finishes on the surface requires a protective layer to protect it against from oxidize and deteriorate, meanwhile the film must with high hardness and abrasion resistance to guarantee the lifetime. Royal Technology spent 6 months in R&D, over 20 times experiment to finalized the proper coating processes. More exciting new is in March 2020, we delivered the massive production machine to our customer's site with a high accomplishment result. Benefits Environmental protection, green process 5fRS, S&fUS Low production cost compared to traditional metal plating processes Excellent corrosion and wear resistance High density and high uniformity B®,lSSlSiiS53tt The film thickness is controllable JJUpqjS Main Features ±11^1 Multiple deposition cathodes for fast deposition rate Strong vacuum pumping system for a short cycle Anode linear ion source to improve adhesion and high density of deposited films 6 units standard planar cathodes mounting flanges Flexible coating processes applied Modular structure design for fast exchange of cathodes and targets 0%Bffi. BM»3R iSit® 6 m-mwm Your Success is Our Success.

Description RTSP1200-PCB RTSP1200-PCB Deposited Films Au gold, Ag silver, Cu copper conductive families films; Corrosion resistance metal families: Tantalum(Ta), Nickle (Ni), Chrome (Cr), Zirconium(Zr) etc. Compounded films: carbon-based metal films, Nitride metal films. Deposition Chamber Cylinder chamber with vertical orientation, one door structure with front opening method Chammber inner size: cpI 200 * HI 500mm Loading Volume (Max.) Central driving rack system, with Max. cf>1000mm *H1100 Deposition Sources 4 Planar sputtering cathodes + 1 mounting flange for upgrading Sputtering Deposition...