Catalog excerpts
SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Product introduction Main parameters Monosilicon pressure transmitter SMP858 monosilicon pressure transmitter is a high performance pressure transmitter with international leading technology meticulously designed by LEEG instrument, using the world's most advanced monosilicon pressure sensor technology and patent encapsulation technology. Monosilicon pressure sensor locates on the top of the metal body and stay away from the medium interface to realizes mechanical isolation and thermal isolation. Glass sintering sensor wire realizes high strength electrical insulation of metal base and improves the capability of flexibility of electronic circuit and transient voltage resistance protection. All these original encapsulation technologies enable SMP858 to easily cope with extreme chemical occasion and mechanical load, and own strong resistance to EMI, sufficient to respond to the most rigorous industrial environment applications, which are the genuine invisible instruments. The fluids which compatible with wetted parts Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 1SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Technical specifications Measuring range and limit Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 2SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Technical Specifications Damping time Total damping time constant: equal to the sum of damping time of amplifer and sensor capsule Damping time of amplifer : 0-100S adjustable Diaphragm capsule (isolated diaphragm and silicon oil filling) damping time: <0.2S Startup after power off : <6S Normal services after data recovery : <31S Power supply Power supply and load requirements Net weight: about 1.6kg(without mounting brackets and process connection accessories) Environment condition *Please consult engineers for details...
Open the catalog to page 3SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Technical Specifications Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 4SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Menu function Transmission module type Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 5SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Product selection instruction Sensor select instruction Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 6SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Product selection instruction Transmission module Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 7SMP858-TST-H monosilicon absolute pressure transmitter SENSING TOMORROW Product drawing and dimension SMP858-TST-H standard drawing and dimension with display( C ) ( unit:mm) SMP858-TST-H standard drawing and dimension without display( A ) ( unit:mm) Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve 2017.01.V1.0
Open the catalog to page 8SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Product drawing and dimension Installation Sketches Installation Sketches Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 9SMP858-TST-H monosilicon absolute pressure transmitter SENSING TOMORROW Product drawing and dimension Process connection (K20) (unit: mm) Process connection (K18) (unit: mm) Installation sketches Installation sketches Standard Specification Size(G) Diaphragm size(ΦM) Standard Specification Size(G) Diaphragm size(ΦM) Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve 2017.01.V1.0
Open the catalog to page 10SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Product drawing and dimension Sealing gasket (M1-M2) (unit: mm) Standard Tri-Clamp Tri-Clamp Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 11SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Ordering information chapter Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 12SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitter Ordering information chapter Disclaimer: all the data used in the product description is not legally binding. Relevant technical details may be changed due to further improve
Open the catalog to page 13SENSING TOMORROW SMP858-TST-H monosilicon absolute pressure transmitterFactory settings and parameters Item Approvals Factory certificate Certification organization Intrinsic safety certificate Certificate organization Certification organization name Flame proof certificate SENSING TOMORROW Shanghai LEEG Instruments Co.,Ltd ADD: No.100 Duhui Road, Minhang District, Shanghai China Postcode:201109 Tel: (86) 21-31261976 Fax: (86)21-31261975 E-mail:sales@leegsensor.com info@leegsensor.com Web: www.leegsensor.com Disclaimer: all the data used in the product description is not legally binding....
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