Humidity and Temperature Sensor ■ Fully calibrated, linearized, and temperature compensated analog output ■ Wide supply voltage range, from 2.4 to 5.5 V ■ 10 to 90% ratiometric analog voltage output ■ Parallel measurement of temperature and humidity Product Summary SHT3x-ARP is the next generation of Sensirion's temperature and humidity sensors. It builds on a new CMOSens® sensor chip that is at the heart of Sensirion's new humidity and temperature platform. The SHT3x- ARP has increased intelligence, reliability and improved accuracy specifications compared to its predecessor. Its functionality includes enhanced signal processing, temperature and humidity can be read out at different pins. The DFN package has a footprint of 2.5 x 2.5 mm while keeping a height of 0.9 mm. This allows for integration of the SHT3x-ARP into a great variety of applications. Additionally, the wide supply voltage range of 2.4 to 5.5 V guarantees compatibility with diverse incorporates 15 years of knowledge of Sensirion, the leader in the humidity sensor industry. Benefits of Sensirion's CMOSens® Technology High reliability and long-term stability Industry-proven technojflf witn^^rack record ok Designed for mass production High process capability Data processing Figure 1 Functional block diagram of the SHT3x-ARP. The sensor signals for humidity and temperature are factory calibrated, linearized and compensated for temperature and supply voltage dependencies.

Sensor Performance Humidity Sensor Performance SHT31 Accuracy tolerance1 Repeatability2 Resolution Integrated Non-Linearity3 Hysteresis Specified range4 Response time6 Long-term drift %RH %RH %RH %RH %RH bit %RH %RH %RH s %RH/yr mV/%RH mV/%RH mV/%RH Table 1 Humidity sensor specification maximal tolerance typical tolerance Figure 3 Typical tolerance of RH over T for SHT30 1 For definition of typical and maximum accuracy tolerance, please refer to the document “Sensirion Humidity Sensor Specification Statement”. 2 The stated repeatability is 3 times the standard deviation (3σ) of multiple consecutive...

DRH (%RH) maximal tolerance typical tolerance Figure 5 Typical tolerance of RH over T for SHT31

Temperature Sensor Performance Parameter Accuracy Repeatability2 Resolution Specified Range Response time 8 Long Term Drift Sensitivity °C/yr mV/°C mV/°C mV/°C Table 2 Temperature sensor specification; values are target specs and not confirmed by measurements yet DT (°C) ±2.0 maximal tolerance typical tolerance Figure 6 Tolerance of the temperature sensor in °C for the SHT30 and SHT31 Recommended Operating Condition The sensor shows best performance when operated within recommended normal temperature and humidity range of 5 – 60 °C and 20 – 80 %RH, respectively. Long term exposure to conditions...

Datasheet SHT3x-ARP Slew rate change of the supply voltage Supply current Output current Capacitive load Voltage changes on the VDD line between VDD V/ms min and VDD max should be below the maximum slew rate At a measurement rate of 2 Hz. A Depends on the resistive load on the output pins Capacitance that can be driven by the sensor on the signal lines Table 3 Electrical specifications, Specification are valid at 25°C and typical VDD Timing Specification for the Sensor System After hard reset, VDD ≥ VPOR Analog output settling time Duration of reset pulse Power-up time Units Comments Time between...

The SHT3x-ARP comes in a tiny 8-pin DFN package – see Table 6. Pin Analog voltage out; output No electrical function; recommended to connect to VSS No electrical function; recommended to connect to VSS Analog voltage out; output Supply voltage; input Reset pin active low; Input; if not used it is recommended to connect to VDD No electrical function; recommended to connect to VSS Ground Table 6 SHT3x-ARP pin assignment (Transparent top view). Dashed lines are only visible from the bottom. The die pad is internally connected to VSS. The electrical specifications of the SHT3x-ARP are shown in Table...

Relative Humidity (%) Voltage out (VRH/VDD) Figure 8 Relationship between the ratiometric analog voltage output and the measured relative humidity Equation 1 Relative humidity conversion formula (result in %RH): Voltage out (VT/VDD) Figure 9 Relationship between the ratiometric analog voltage output and the measured temperature Equation 2 Temperature conversion formula (result in °C and °F respectively)

SHT3x-ARP sensors are provided in a DFN package. DFN stands for dual flat no leads. The humidity sensor opening is centered on the top side of the package. The sensor chip is made of silicon and is mounted to a lead frame. The latter is made of Cu plated with Ni/Pd/Au. Chip and lead frame are overmolded by an epoxy-based mold compound leaving the central die pad and I/O pins exposed for mechanical and electrical connection. Please note that the side walls of the sensor are diced and therefore these diced lead frame surfaces are not covered with the respective plating. The bottom line consists...

Package Outline Figure 11 Dimensional drawing of SHT3x-ARP sensor package Parameter Package height Leadframe height Pad width Package width Center pad length Package length Center pad width Pad pitch Pad length Max cavity Center pad marking Only as guidance. This value includes all tolerances, including displacement tolerances. Typically the opening will be smaller. indicates the position of pin 1 Table 7 Package outline Land Pattern Figure 12 shows the land pattern. The land pattern is understood to be the metal layer on the PCB, onto which the DFN pads are soldered. The solder mask is understood...

land pattern stencil aperture sensor outline Figure 12 Recommended metal land pattern and stencil apertures for the SHT3x-ARP. The dashed lines represent the outer dimension of the DFN package. The PCB pads and stencil apertures are indicated through the shaded areas. NOTES: 1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2 2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED AS TRUE POSITION OF POCKET, NOT POCKET HOLE 3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R" ABOVE THE BOTTOM OF THE POCKET Figure 13 Technical drawing of the packaging tape with sensor orientation in tape. Header...