656T SERIES
3Pages

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Catalog excerpts

656T SERIES - 1

THERMALLY ENHANCED XSOP Features • Compact size for maximum board density • Wide target area for easy entry and removal of IC leads • Dual face-wipe contacts for long, dependable life • Excellent component clearance under the socket • Four high corner standoffs for easy inspection and cleaning of the PC board • For temperatures up to 150°C; for higher temperature applications consult the factory MATERIALS AND SPECIFICATIONS Socket Body Note: T = with thermal contact Copyright © 2018 Sensata Technologies, Inc. Sensata Technologies

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656T SERIES - 2

Copyright © 2018 Sensata Technologies, Inc. Sensata Technologies

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656T SERIES - 3

DESCRIPTION & ORDERING INFO 656 X X XX XX X X TXXX Revised 02/06/18 Sensata Technologies, Inc. ("Sensata") data sheets are solely intended to assist designers ("Buyers") who are developing systems that incorporate Sensata products (also referred to herein as "components"). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyer's systems and products. Sensata data sheets have been created using standard laboratory conditions and engineering practices. Sensata has not conducted any testing other...

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