613 SERIES
4Pages

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Catalog excerpts

613 SERIES - 1

Features • Compact size for maximum board density • Wide target area for easy entry and removal of IC leads • Dual face-wipe contacts for long, dependable life • Excellent component clearance under the socket • Four high corner standoffs for easy inspection and cleaning of the PC board • For temperatures up to 150°C; for higher temperature applications consult the factory Copyright © 2018 Sensata Technologies, Inc. Sensata Technologies

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Copyright © 2018 Sensata Technologies, Inc. Sensata Technologies

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SIDE BRAZED MOLDED PACKAGE STYLE STYLE RECOMMENDED FORM OF DEVICE LEADS Copyright © 2018 Sensata Technologies, Inc. Sensata Technologies

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DESCRIPTION & ORDERING INFO Series Lead Count Contact Plating 23: Select Gold with Gold Flash Tails Contact Material 1: BeCu Insulator Material Sensata Technologies, Inc. (“Sensata”) data sheets are solely intended to assist designers (“Buyers”) who are developing systems that incorporate Sensata products (also referred to herein as “components”). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyer’s systems and products. Sensata data sheets have been created using standard laboratory conditions and...

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