Catalog excerpts
Content Backcover SEMIKRDN innovation+service MiniSKiiP20 Years of Innovation Power Electronics 2017 - 2018
Open the catalog to page 1Backcover CLASSES LINES MiniSKiiP® – Anticipating the Future for 20 Years 20 years ago the MiniSKiiP was born. A unique design, setting a new standard in the power electronics world: solder-free PCB assembly using spring contacts, leading to the shortest of assembly times, easy PCB design and a high degree of connection reliability, resulting in an immediate system cost benefit. With more than 35 million modules in the field, MiniSKiiP has changed the world of power electronics. It is the first module available with pre-applied Thermal Interface Material, one of the first industrial...
Open the catalog to page 2Backcover CLASSES LINES
Open the catalog to page 3Backcover CLASSES LINES 1500VDC in Solar ? We Cover all Your Needs An increase in the DC voltage in your solar applications of up to 1500VDC enables a significant reduction in system costs as well as the optimization of annual energy production. To comply with these challenging conditions, SEMIKRON offers a comprehensive product portfolio for your 1500V photovoltaic inverter: starting from power modules in 2-level and 3-level topologies to high-power SKiiP 4 IPMs and ready-to-use power stacks – we are your partner at all integration levels. Within a wide power range, SEMIKRON provides power...
Open the catalog to page 4Backcover CLASSES LINES Expect More from Standard Modules Industry Standard Power Module Packages Industry standard power module packages are commodities today. Supply chain safety for these modules is one of the most important requirements. Being compatible on the one hand, SEMIKRON standard modules even exceed these standards on the other hand. At the same time, however, power densities and reliability requirements are constantly increasing. Today, SEMIKRON’s extensive power module portfolio already meets all these requirements. With the introduction of the SEMiX 6, every single industry...
Open the catalog to page 5Backcover CLASSES LINES When Time to Market Counts Customized Stacks Qualified Platforms We are the global market leader in power electronic stacks with over 200,000 assemblies in the field. Five global stack centers provide optimized, pre-qualified and field-tested stack assemblies. Our stacks feature short lead times while still being easy to customize for your needs. Our global stack centers provide worldwide coordination, engineering, manu-facturing and testing to localize manufacturing of your stack assemblies. You want to... - reduce time to market - limit your financial investment -...
Open the catalog to page 6SEMiX, SEMITOP, SKYPER , SEMITRANS 14 Product Lines Stacks Water-Cooled IGBT Stacks 42 Air-Cooled IGBT Stacks 44 Discretes Discrete Diodes / Discrete Thyristors / Rectifier Bridges 52 Product Classes 02 Silicon Carbide Modules, Full SiC, Hybrid SiC 98 10 Discretes Chips, Discrete Diodes / Discrete Thyristors 196 11 Accessories Thermal Interface Materials / Heatsinks, Fans 214 Service & Contact SEMIKRON Online Shop / Worldwide Contact 226 CLASSES LINES
Open the catalog to page 7Backcover CLASSES LINES The Complete Press-Fit Standard SEMiX 6 features the latest in state-of-the-art press-fit pin technology for power and auxiliary terminals. The 17-mm-high SEMiX product family features solder-free assembly technology. The SEMiX 6 concept is designed to maximize the efficiency of our customers’ mounting processes by enabling all the terminals to be connected in one production step. The SEMiX 6 completes the SEMIKRON commodity product portfolio. Key features Fully compatible to industry standard Solder-free assembly 17mm in height Press-fit technology for auxiliary and...
Open the catalog to page 8Backcover CLASSES LINES New Voltage Class and Increased Power Density SEMITRANS is a robust industrial standard package with copper baseplate and screw terminals for the power connections. Besides the tried and tested 600V IGBT design, the SEMITRANS is now also available with the latest 650V chips, enabling faster switching and lower switching losses. The power range of SEMITRANS 3 in 1200V has been extended to include 600A half-bridges, delivering 30% higher output power in the same package. Key features Available in 600V, 650V, 1200V and 1700V From 25A to 900A Half-bridge, single switch,...
Open the catalog to page 9Exceeding the Standard SEMITRANS 10 is a robust industrial standard package with copper baseplate and screw terminals for the power connections. The SEMITRANS 10 package features a low-inductance design supporting 1200V (1400A) and 1700V (1000A/1400A) half-bridge topologies as well as MLI in 1200V IGBT technology and 1200A nominal current. Key features Fully compatible with industry standard Half-bridge topology Current rating from 1000A to 1400A Enhanced switching performance Isolated copper baseplate using DBC technology Integrated gate resistors Integrated temperature sensor High...
Open the catalog to page 10Product Lines Modules MiniSKiiP 22 Stacks Water-Cooled IGBT Stacks 42 Air-Cooled IGBT Stacks 44 Discretes Discrete Diodes - Discrete Thyristors - Rectifier Bridges 52 CLASSES LINES
Open the catalog to page 11Backcover CLASSES LINES Fast, Cost Efficient and Reliable One Screw Mounting Short facts required for time-consuming solder processes, no special tools Low cost assembly, high production run rate, high yield are needed for MiniSKiiP assembly. Instead, a single screw Small and compact inverter design connection is used. The printed circuit board (PCB), the power High reliability and long product life time Key features Solder-free SPRiNG technology for fast and easy assembly W ithout copper baseplate for cost efficient concept module and the heat sink are assembled in one mounting step. This...
Open the catalog to page 12Backcover CLASSES LINES Flexible and High Performing Product for a Comprehensive Portfolio The SEMITOP platform centers around 12-mm-high modules, covering the low and medium-power range, with one or two Short facts 12mm module height Reliable solder or press-fit connection Low stray inductance case mounting screws and no baseplate, featuring PCB interface via solder or press-fit pins. Low commutation inductance design and the availability of latest Si and SiC chip technologies make this product suitable for UPS and solar applications, motor drives, power supplies, welding and the new EV...
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