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SEMIKRON
Flyer Thermal Interface Materials

Flyer Thermal Interface Materials

Product catalog summary

Overview
SEMIKRON provides a range of Thermal Interface Materials (TIM) designed to enhance heat dissipation in power modules. These materials include silicone-based and silicone-free greases, Phase Change Materials (PCM), and a new High Performance Thermal Paste (HPTP).

Specifications and Materials
- Silicone-based and Silicone-free Greases: Used for modules without baseplates to improve assembly robustness.
- Phase Change Material: Applied to modules with baseplates, offering a non-smearing TIM layer.
- High Performance Thermal Paste: A silicone-based grease that enhances thermal conductivity, suitable for baseplate-less modules.

Advantages
- Increased productivity and reduced handling costs.
- Low thermal resistance and optimized TIM layer thickness.
- Improved lifetime and reliability of modules.
- Modules can be shipped directly to assembly lines.
- Lower overall costs.

Key Features of High Performance Thermal Paste
- Outstanding thermal performance with up to 50% lower chip-to-heat sink thermal resistance.
- Potential for up to 25% more module output power or significant lifetime increases.
- No need for expensive ceramic substrates.
- Proven long-term reliability without pump-out.
- No screw retightening required after initial operation.

Phase Change Material Benefits
- Optimized thermal resistance Rth(j-s).
- No screw retightening required after first operation.

Conclusion
SEMIKRON's TIM solutions are designed to meet diverse application requirements and environmental conditions, offering improved thermal management and reliability for power modules.

Catalog excerpts

SEMIKRON innovation+service High Performance Thermal Paste Phase Change Material

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SEMIKRON was the first power module manufacturer on the market to offer power modules with a pre-applied Thermal Interface Material. With more than 2 decades of field experience and more than 10 million pre-printed modules in the field, new reliability benchmarks are being set. Given the numerous application requirements and a multitude of environmental conditions, SEMIKRON offers a wide range of Thermal Interface Materials. In addition to the standard silicone and silicone-free thermal greases, a Phase Change Material and a new High Performance Thermal Paste with improved thermal performance...

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High Performance Thermal Paste Outstanding thermal performance and increased lifetime boosting the performance of baseplate-less modules. The material is a silicone-based thermal grease with outstanding thermal conductivity. Replacing standard TIM materials with High Performance Thermal Paste results in either a lower chip temperature and therefore longer power module lifetime, or it allows for higher output currents in the given application. Any combination of both benefits, longer life time and higher output current is possible with small trade-offs. assembly robustness and means the client...

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We are close to our customerswww.semikron.com/contact “W shop.semikron.com www.youtube.com/c/semikron in de.linkedin.com/company/semikron 11 29 07 40 05/2017 Note: All information is based on our present knowledge and is to be used for information purposes only. The specifications of our components may not be considered as an assurance of component characteristics.

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Flyer Thermal Interface Materials

Flyer Thermal Interface Materials

Catalog excerpts

All SEMIKRON catalogs and technical brochures