*mydirectindustry

Catalogs
SEMIKRON
Flyer SKiiP

Flyer SKiiP

Product catalog summary

Overview: The document presents the SKiiP 4, a highly powerful Integrated Power Module (IPM) by SEMIKRON, designed for applications ranging from 500kW to 2.1MW. It highlights the advanced features and benefits of the SKiiP 4, emphasizing its reliability and efficiency in power electronics.

Specifications: The SKiiP 4 utilizes IGBT 4 and CAL4F technology, with a maximum junction temperature (Tj, max) of 175°C, enabling higher current capabilities. It supports a new 1500VDC version suitable for photovoltaic solar power applications and allows for parallel operation to increase output power.

Technological Advancements: The module features sinter technology, which improves thermal resistance by 5% and provides an unbreakable joint between chips and DCB. The sintered chips eliminate solder fatigue, offering a high melting point of over 900°C, significantly higher than standard solder.

Design and Reliability: The SKiiP 4 boasts a robust mechanical design with a new pressure contact design for low-inductive and homogeneous current distribution. It includes integrated protection functions, a CANopen interface for error recording and parameterization, and enhanced reliability through ASIC technology.

Performance and Benefits: The SKiiP 4 offers extremely high power cycling capability, with thermal cycling performance five times higher than standard modules. It integrates current, voltage, and temperature sensors, providing comprehensive monitoring and protection.

Product Range: The SKiiP 4 product range includes 1200V and 1700V IGBT half bridges, available in configurations of 3, 4, or 6 parallel units, supporting power cycles in the thousands and power outputs from 500kW to 2.1MW.

Catalog excerpts

Most Powerful IPM on the Market

Open the catalog to page 1

Power cycles in thousands Sinter technology - 5% improvement of total thermal resistance thanks to sinter layer - Unbreakable joint between chips and DCB - High melting point at > 900°C (4 x higher than standard solder) no solder fatigue IGBT 4 and CAL4F technology - Tj, max = 175°C, the key to higher current capability Highest reliability New pressure contact design - Low-inductive design - More homogeneous current distribution Robust mechanical design - High ruggedness against mechanical shock and vibration Advanced driver design - Enhanced FIT rate by ASIC technology - Switching and sensor...

Open the catalog to page 2

Flyer SKiiP

Flyer SKiiP

Catalog excerpts

All SEMIKRON catalogs and technical brochures