Most Powerful IPM on the Market

Power cycles in thousands Sinter technology - 5% improvement of total thermal resistance thanks to sinter layer - Unbreakable joint between chips and DCB - High melting point at > 900°C (4 x higher than standard solder) no solder fatigue IGBT 4 and CAL4F technology - Tj, max = 175°C, the key to higher current capability Highest reliability New pressure contact design - Low-inductive design - More homogeneous current distribution Robust mechanical design - High ruggedness against mechanical shock and vibration Advanced driver design - Enhanced FIT rate by ASIC technology - Switching and sensor...