Flexible Architecture and High-Performance Chip Technologies in a Compact Design

SEMITOP ® The SEMITOP family is a 12-mm-height module family for the low and medium-power range, featuring a single mounting screw, without baseplate, and PCB interface via solder or press-fit pins. Low commutation inductance design and the use of the latest Si and SiC chip technologies make this product suitable for UPS and solar applications, motor drives, power supplies and welding equipment. Benefits SEMITOP features a single mounting screw for quick and easy SEMITOP with press-fit or solder pins is a useful product for the assembly to the heatsink, far faster than with two lateral low and...

Flexible Architecture and High-Performance Chip Technologies in a Compact Design Circuit Flexible and compact design for a broad product portfolio - different housing sizes for a wide power range: 4 SEMITOP4, SEMITOP3, SEMITOP2, SEMITOP1 - Available with solder terminals or press-fit pins - lexible layout routing to fit the most complex of F configurations High-performance product featuring the latest SiC chip technologies - ull SiC solution: SiC MOSFET, F with or without SiC Schottky free-wheeling diode - ybrid solution: Si IGBT with SiC Schottky H free-wheeling diode - ow-inductance design...

We are close to our customers www.semikron.com/contact shop.semikron.com www.youtube.com/c/semikron in de.linkedin.com/company/semikron 11 29 08 10 05/2017 Note: All information is based on our present knowledge and is to be used for information purposes only. The specifications of our components may not be considered as an assurance of component characteristics.