Overview
The document provides an overview of SEMIKRON's SEMITOP® module family, designed for low and medium-power applications. These modules feature a compact design with a 12-mm height, single mounting screw, and PCB interface options via solder or press-fit pins. They are suitable for various applications including UPS systems, solar, motor drives, and welding equipment.

Specifications
- SEMITOP modules are available in different configurations, supporting fast-Si diodes, fast IGBTs, and MOSFETs, including the latest SiC chip technologies.
- The product range includes 3-phase inverters, CIB configurations, single-leg inverters, T-type inverters, and MOSFET configurations.
- Key features include a central mounting screw, no baseplate design, low thermal resistance, and high integration level for compact design.

Benefits
- Quick and easy assembly with a single mounting screw, reducing assembly time and material costs.
- Homogeneous pressure distribution ensures low thermal resistance and reliable performance.
- Flexible architecture allows for customer-specific designs and multiple paralleling on the same PCB.

Applications
- Suitable for low and medium-power applications requiring flexibility and high integration.
- Supports configurations like 3-level inverters, double boost, and interleaved boost applications.

Product Range
- SEMITOP modules come in four housing sizes: SEMITOP4, SEMITOP3, SEMITOP2, and SEMITOP1.
- Available with solder terminals or press-fit pins for flexible layout routing.

Key Features
- Central mounting screw for low mounting costs and reliable assembly.
- Insulated module with low-inductance design.
- Wide range of Si and SiC chip technologies for high-performance applications.

Contact Information
SEMIKRON International GmbH, Sigmundstrasse 200, 90431 Nuremberg, Germany. Tel: +49 911 6559 6663, Fax: +49 911 6559 262, Email: [email protected], Website: www.semikron.com