Introduction
The document provides an overview of SEMIKRON's SEMITOP Press-Fit modules, which offer an alternative to traditional solder mounting. These modules are designed for fast assembly to PCBs without soldering, making them suitable for various applications such as motor drives, solar energy, and power supplies.

Specifications
- Solder-free mounting for quick assembly.
- Available in three housing sizes: SEMITOP 4, SEMITOP 3, and SEMITOP 2.
- Customizable with advanced topologies.
- Features a single central mounting screw for easy installation.
- High thermal performance due to homogeneous pressure distribution.
- Compatible with the latest Si and SiC chip technologies.

Benefits
- Ensures easy and fast mounting, reducing assembly time.
- 100% pin-out compatibility with existing SEMITOP versions.
- Maintains the same electrical and thermal performance as soldered versions.
- Ideal for applications requiring performance, reliability, and efficient assembly.

Applications
- Suitable for low and medium power ranges.
- Applicable in UPS, solar, motor drives, and welding markets.
- Supports configurations like 3-level inverters, double boost, and interleaved boost applications.

Product Range
- Offers a variety of configurations with different chip technologies.
- Includes 3-phase inverters, CIB configurations, single leg 3-level inverters, mixed 3-level inverters, MOSFET configurations, and 3-phase bridge rectifiers.

Key Features
- High integration level for compact design.
- Low mounting costs with one central screw.
- No baseplate, reducing thermal resistance.
- Press-fit pins for faster PCB assembly.
- 12 mm height for compactness.
- Wide range of available chip technologies.
- Flexible platform for custom designs.