Energy Efficient Innovations An extensive offering of digital and mixed-signal ASICs, FPGA and SSKE ASIC conversion, CMOS image sensors, and advanced foundry processes from ON Semiconductor.

Optimize Your Board’s Design and Cost Using Benefits to Customers • ON Semiconductor coordinates specification, design, manufacturing, packaging, testing, and delivery of production ASICs • Enhance product differentiation with features unavailable in standard solutions • Save energy with efficiencies gained through integration and design optimization • Save board space by miniaturizing product size through integration and advanced packaging options • Protect IP investment through hardware embedding • Reduce cost in overall application • Improve reliability by reducing the number of components...

Customized Solutions from ON Semiconductor Custom Product Capabilities • Application Specific Integrated Circuits (ASIC) » Mixed-Signal ASICs for Automotive, Industrial, Medical and other markets » Digital ASICs for Mil/Aero, Industrial, Communications and other markets » FPGA-to-ASIC and ASIC-to-ASIC conversions • Integrated Passive Devices for portable, wireless and RF applications • Electro-optical products » CMOS image sensors for machine vision, medical, 2D barcode, military, and space applications, with broad IP portfolio » Light sensors for consumer and industrial applications » Scanner...

Energy Efficient innovations Mixed-Signal ASIC Development Services ASIC Product Definition • Critical in setting the stage for mixed-signal ASIC development success • Senior-level system architects review your concept, advise architecture, and assist in developing an ASIC specification • Advanced packaging capabilities • Magnetic Flux • Angular Rate Electrical System: • Stepper Motors • MOSFETs & BJTs • LCD/LED Displays Design Engineering • Approximately 200 expert mixed-signal designers with extensive SoC and SiP • Robust custom development process • Dedicated project managers track & report...

Digital ASIC Solutions Proven Expertise The comprehensive digital ASIC offering from ON Semiconductor includes multiple manufacturing locations with state-of-the-art to legacy technologies to support your design requirements. We provide complete solutions from product development, manufacturing, test, and packaging, to quality engineering support and supply. We offer early engagement with our System Architects to assess the best overall technical solution enabling a strong partnership throughout each step of the project lifecycle, from concept to production. ON Semiconductor supports reliable...

Digital Standard Cell Product Families Standard Cell Product Families Family Core Voltage I/O Voltage I/O Types System Performance SC5 0.5 mm 5V 5 V, 3.3 V PCI, TTL, LVTTL, LVCMOS 75 MHz SC3 0.35 mm 3.3 V, 2.5 V SP65 65 nm PCI, GTL, HSTL, SSTL, LVTTL, LVCMOS, LVPECL PCI, DCI, HSTL, SSTL, LVTTL, 1.8 V, 1.5 V 3.3 V, 2.5 V, 1.8 V LVCMOS, LVPECL, LVDS 3.3 V, 2.5 V, PCI, DCI, HSTL, SSTL, LVTTL, 1.2 V 1.8 V, 1.5 V, 1.2 V LVCMOS, LVPECL, LVDS, CML 3.3 V, 2.5 V, PCI, DCI, HSTL, SSTL, LVTTL, 1.2 V, 1.0 V 1.8 V, 1.5 V, 1.2 V LVCMOS, LVPECL, LVDS, CML SP40 40 nm 1.1 V, 0.9 V ONC18 180 nm SP110 110 nm 5...

ASIC Conversions FPGA-to-ASIC, ASIC-to-ASIC ASIC Conversions and EOL Solutions ON Semiconductor’s End-of-Life (EOL) support program is designed to provide a long-term solution to customers facing device or process obsolescence with their current ASIC or FPGA vendor. We provide reliable second sourcing options as well as cost reduction solutions to help you maintain your competitive edge. Conversion of an older technology to an optimized ASIC solution can provide a mid-life kicker, enhancing your product performance and reducing cost. FPGA Conversions ON Semiconductor is the industry leader specializing...

Space Efficient RF System-in-Package Solution (IPD: Integrated Passive Device) Integrating passive devices in our HighQSM Copper-on-Silicon Integrated Passive Device Platform gives customers a high performance, cost effective solution for their RF system-in-package needs. Our high resistivity silicon, thick copper options, and advanced 8 inch toolset provide unmatched performance. Our full featured design kit, available design support or turn-key solutions, and simulation to silicon match, enable first-time-right designs. Typical Application Space • Cost sensitive • Size sensitive • Low power...

IPD Cost Effective Design Process Relative Performance (Q) • Smaller area than discrete solutions • Thinner & higher precision than LTCC • Lower cost than GaAs • Better performance than other silicon solutions ON Semiconductor LTCC Au on GaAs Discrete Solution ON Semiconductor HighQ IPD Success Zone Q = 25 - 40 SM Cost Reduction Relative Cost ($) Flexible Services and Tools Quick Fit Analysis • ON Semiconductor provides estimated performance, die size, and price for a customer specification based on HighQSM IPD technology • Often performed within 3-7 days Customer Design • After NDA, ON Semiconductor...

Custom Foundry Services Overview ON Semiconductor has a broad portfolio of custom and standard foundry offerings, including mixed-signal processes and the HighQSM copper-on-silicon integrated passive device (IPD) process. Our mixed-signal processes with high voltage and low power options are ideally suited for products in sensor applications and in the communication, mil/aero, automotive, medical and industrial markets. The HighQ copper-on-silicon IPD process offers cost competitive technology produced in an advanced 200 mm manufacturing facility and is ideal for RF applications. Other offerings...

CMOS & BCD Platforms 100 V I2T100 Flexible Manufacturing • Flexible manufacturing available (process modifications, lot splits, etc.) • Multiple fab strategy with dual sourcing possible • Specialty services such as advanced die stitching, shuttle services for prototyping in 0.25 μm and 0.18 μm technologies 80 V Voltage • Wide variety of standard CMOS, BCD and high voltage process offerings I4T100* I3T80 I4T70* 50 V I4T45* I3T50 I2T30(E) ONBCD25 25 V C5 5V I3T25 C3/D3 0.7 μm • Low volume strategic engagements 0.6 μm B-C-D • Partial fab processing, and assembly and test services 0.35 μm Geometry...