Introduction
This section outlines the warranty, information and assistance, RMA number request, safety guidelines, electrostatic discharge precautions, RoHS compliance, safety policies, terminology, and reference specifications. It stresses the proprietary nature of the information and prohibits unauthorized use or disclosure.
Overview
The document introduces the COMe-C42-BT7 module, detailing its technical and electrical specifications, including power rails and consumption. It provides mechanical specifications and a block diagram to offer a comprehensive understanding of the module's design and functionality.
Connectors
This section describes various connectors on the module, such as the FAN connector, JTAG connector, SO-DIMM DDR4 slots, BIOS restore switch, and COM Express® Module connectors. Each connector's purpose and specifications are outlined to ensure proper usage and integration.
BIOS Setup
The BIOS setup section explains the Aptio setup utility, covering the main setup menu, advanced menu, chipset menu, security menu, boot menu, save & exit menu, and event logs menu. It provides detailed instructions on configuring system settings, including AMD CBS, iSCSI, network connections, and more.
Appendices
The appendices include additional information on thermal design, offering guidelines for maintaining optimal operating temperatures and ensuring system reliability.
Warranty
The product is covered under the Italian Law Decree 24/2002, aligning with the European Directive 1999/44/CE regarding consumer sales and warranties. The warranty period is one year, with repair, replacement, or credit offered at the supplier's discretion. Customers are responsible for shipping costs for non-conforming or replacement items. Returns require prior authorization via a form on the supplier's website, and items must be returned with all original accessories and packaging.
Information and Assistance
If the product is faulty, SECO S.p.A. provides several support options: accessing product information on their website, contacting a sales representative, or reaching out to the technical assistance team via email or fax. Faulty products can be sent to the SECO Repair Centre with an RMA number, and items must be properly packaged to avoid damage.
RMA Number Request
To obtain an RMA number, customers should visit SECO's website and follow the online procedure. An RMA number will be issued within one working day for online requests.
Safety and Handling
The COMe-C42-BT7 module operates at extremely low voltages and requires careful handling to prevent damage. It is sensitive to electrostatic discharges, and users should ground themselves and use anti-static surfaces when handling the module. The module is RoHS compliant, and users should ensure power is off before handling or connecting components.
Safety Policies
The module must be used within a fire enclosure or an appropriate enclosure to meet safety standards. Manufacturers using the module in end-user products must ensure compliance with relevant safety standards and prescribe operating conditions.
Terminology and Definitions
The document provides definitions for various technical terms and interfaces relevant to the module, such as ACPI, AHCI, BIOS, and PCI-e.
Reference Specifications
A list of applicable industry specifications and reference documents is provided, including links to standards for ACPI, AHCI, Com Express, and others.
Technical Specifications
The module supports various AMD EPYC Embedded processors, up to 128GB of DDR4 memory, multiple USB and Ethernet ports, and PCI-e lanes. It includes interfaces for SPI, I2C, and others, with power supplied at +12VDC.
Specifications
The COMe-C42-BT7 is a COM Express board with dimensions of 125 x 95 mm. It operates within a temperature range of 0°C to +60°C for the commercial version and -40°C to +85°C for the industrial version. The board requires an external +12VDC power supply and a 5V standby voltage for ATX mode. A backup battery voltage is necessary for the Real Time Clock and CMOS memory data retention.
Electrical Specifications
The board's power consumption is measured using a CCOMe-C79 Carrier board. It requires a carrier board for normal operation, and all connections are made through this board. Power consumption varies based on the CPU and configuration, with specific measurements provided for different states such as idle, boot, and stress test.
Mechanical Specifications
The board is a Basic form Factor type with a 12-layer printed circuit for disturbance rejection. It supports up to four SO-DIMM slots for DDR4-2666 memory, with specific height requirements for the carrier board plug to accommodate maximum memory deployment.
Connectors
The board features two 220-pin connectors (A-B and C-D) for interfacing, a 3-pin or 4-pin FAN connector for cooling, a JTAG connector for testing and debugging, and SO-DIMM slots for memory. The BIOS Restore switch allows resetting to factory defaults if needed.
Block Diagram
The block diagram outlines the connections and components on the board, including the AMD EPYC Embedded 3000 Series SoC, DDR4 memory slots, Ethernet controller, and various interfaces such as PCI-e, USB, and SATA.
Recommendations
Users must ensure proper cooling solutions are in place to maintain the heatspreader/heatsink temperature within specified limits. The use of an external fan is application-dependent, and considerations for thermal dissipation are detailed in chapter 5.1 of the manual.
Procedures
The manual provides detailed pin configurations for connectors CN1 Rows A, B, C, and D, specifying signal types and their respective pin numbers. It includes instructions for connecting Ethernet interfaces directly to an RJ-45 connector on the carrier board.
Standards and Recommendations
The module adheres to COM Express Specifications, supporting NC-SI signals for BMC management and 10GBASE-KR interfaces managed by the AMD EPYC Embedded 3000 SoC. It recommends using only necessary differential lanes for FastEthernet and leaving unused pairs unconnected.
Key Signals and Interfaces- Gigabit Ethernet Signals: Includes MDI differential pairs and activity/link indicators.
- NC-SI Signals: Managed by the Intel® I210 controller, includes clock, data, and arbitration signals.
- 10Gb Ethernet Signals: Managed by the AMD EPYC SoC, includes transmit/receive pairs and I2C management interfaces.
Critical Information
The manual emphasizes the importance of independent analysis and judgment in using the provided schematics, which are offered "AS IS" without warranties. It highlights the need for careful implementation of Ethernet interfaces and adherence to signal management guidelines.
I2C and LED Signal Management
The module uses I2C ports managed by the EPYC Embedded 3000 I2C Port #1/SFP I2C Port. Key signals include 10G_LED_SDA and 10G_LED_SCL for LED and PHY strap data transfer, and interrupt pins (10G_INT0 to 10G_INT3) for xGbE ports, all with 3.3V_ALW signals and 2k2Ω pull-up resistors.
S-ATA Signals
The module supports up to eight S-ATA interfaces, with two available on connector AB, compliant with Gen3 standards supporting data rates of 1.5Gbps, 3.0Gbps, and 6.0Gbps. The document provides details on the differential pairs for transmit and receive channels and mentions the use of 10nF AC series decoupling capacitors.
PCI Express Interface Signals
The module offers 24 PCI Express lanes managed by the AMD EPYC Embedded 3000 SOCs, supporting PCI Express Gen 3 (8.0GT/s). Lanes can be grouped into various configurations via BIOS settings, with a maximum of 7 root ports for lanes #0 to #7 and 8 root ports for lanes #16 to #31.
USB Interface Signals
The module supports USB 2.0 and USB 3.1 Gen1 interfaces, with up to four ports available. USB 2.0 ports support HS, FS, and LS, while USB 3.1 ports provide SuperSpeed capabilities. Overcurrent detection and EMI/ESD protection are emphasized, with specific components and configurations detailed for implementation.
LPC Interface Signals
The module provides an LPC interface for managing the embedded microcontroller, with signals such as LPC_AD[0-3], LPC_CLK, LPC_FRAME#, and LPC_SERIRQ. The document outlines the electrical levels and necessary pull-up resistors for these signals.
SPI Interface Signals
The module includes a dedicated SPI controller for connecting Serial Flash devices, primarily for BIOS support. Key signals include SPI_CS#, SPI_MISO, and others, with specific electrical levels and pull-up resistor requirements.
UART Interface Signals
The module offers two UART interfaces managed by the embedded controller, with signals such as SER0_TX, SER0_RX, SER1_TX, and SER1_RX at a 3.3V_RUN electrical level. Schottky-diodes are added for +12V tolerance.
Miscellaneous Signals
Includes signals like WDT, FAN_PWMOUT, FAN_TACHIN, TPM_PP, THRM#, and THRMTRIP#, each with specific voltage levels and functions related to system management and thermal control.
Power Management Signals
Signals such as PWRBTN#, SYS_RESET#, CB_RESET#, PWR_OK, and various SUS signals manage power states and transitions, with specific voltage levels and pull-up resistors.
SMBus Signals
Managed by the Embedded Controller, the SMBus interface includes SMB_CK, SMB_DAT, and SMB_ALERT# signals for system management.
GPIO Interface Signals
There are 8 pins for General Purpose Inputs and Outputs, managed by the embedded microcontroller, with specific electrical levels and resistors.
Aptio Setup Utility
The setup utility allows configuration of the board using the Aptio Setup Utility stored in onboard SPI Serial Flash. It includes various menus such as Main, Advanced, Chipset, Security, Boot, and Save & Exit.
Advanced Menu
Includes configuration options for AMD CBS, iSCSI, network connections, battery failure management, trusted computing, ACPI settings, and more.
AMD CBS Configuration
Submenus for configuring Zen Common Options, Data Fabric, Unified Memory Controller, Northbridge IO, and other AMD-specific settings.
Voltage and Fan Control
The manual allows for automatic or manual setting of the CLDO_VPP voltage, which requires a system restart to take effect. Fan control can be set to auto or manual, with options to force PWM control and customize fan speed based on temperature thresholds.
Hot Plug and PCIe Settings
Options are available to enable or disable PCIe loopback mode and configure CRS delay and limits. The document also details settings for enabling IOMMU and concurrent training.
Storage and Network Configuration
SATA and USB configurations can be customized, including enabling/disabling controllers and setting modes. Network settings include iSCSI initiator naming, NIC configuration, and Wake On LAN options.
Security and Trusted Computing
Security device support can be enabled or disabled, with options for TPM version selection and hierarchy settings. The document also includes settings for ACPI auto configuration and legacy resource locking.
Advanced Configuration
The manual provides detailed options for configuring PCIe lanes, NTB settings, and CPU virtualization. It also includes settings for console redirection, including terminal type and transmission speed.
Additional Features
Other settings include RTC wake options, battery failure management, and trusted computing configurations. The document provides comprehensive options for customizing system behavior and performance.
USB Configuration
The document outlines various USB settings including Legacy USB Support, XHCI hand-off, USB Mass Storage Driver Support, and emulation options. It specifies time-out settings for USB transfers and device power-up delays.
Network Stack Configuration
Options for enabling or disabling UEFI Network Stack and PXE/HTTP support for both IPv4 and IPv6 are detailed. Configuration policies and boot wait times are also discussed.
CSM Configuration
This section covers the Compatibility Support Module (CSM) settings, including GateA20 activation, Option ROM messages, INT19 trap responses, and boot option filters for UEFI and Legacy systems.
NVMe and SATA Configuration
Device options are dependent on the NVMe and SATA devices present in the system.
Thermal Configuration
Critical and passive cooling temperatures are set, along with thermal constants and sampling periods for passive cooling.
Embedded Controller Configuration
Includes settings for LID_BTN# configuration, SMB_ALERT# wake, hardware monitoring, reset causes, and various fan settings. It also covers watchdog configuration and GPIO settings.
Chipset Menu
Discusses SMT mode, PCIe link training, and North Bridge information.
Security Menu
Covers secure boot settings, including administrator and user passwords, secure boot modes, and key management options.
Secure Boot Configuration
The document outlines procedures for configuring Secure Boot, including installing factory default keys, enrolling EFI image files, and managing various certificates and keys such as Platform Key, Key Exchange Keys, and Authorized Signatures. It emphasizes the importance of configuring NVRAM with OEM-defined factory default Secure Boot keys.
Boot Menu Options
The boot menu section provides detailed options for configuring system boot settings. Key options include Setup Prompt Timeout, Bootup NumLock State, Quiet Boot, Fast Boot, SATA Support, VGA Support, USB Support, PS2 Devices Support, Network Stack Driver Support, and Redirection Support. It also covers the selection of boot modes (LEGACY/UEFI) and the system boot order.
Save & Exit Menu
This section describes options for saving or discarding changes made in the system setup. Options include Save Changes and Exit, Discard Changes and Exit, Save Changes and Reset, Discard Changes and Reset, and Restore Defaults. It also includes launching the EFI Shell from a filesystem device.
Event Logs Menu
The document details the configuration of SMBIOS Event Log settings, including enabling/disabling event logging, erasing event logs, and managing log behavior when full. It also covers logging system boot events and OEM codes.
Thermal Design Considerations
The thermal design section emphasizes the importance of effective heat dissipation for the COMe-C42-BT7 module. It discusses the use of heatspreaders and heatsinks, highlighting that the heatspreader is not a standalone cooling solution but a means to transfer heat to other cooling devices. The document advises customers to carefully evaluate and develop cooling solutions based on processor workload, utilization scenarios, and system enclosures.