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COM Express Custom Solutions

COM Express Custom Solutions

COM Express Custom Solutions

Product catalog summary
COM Express Architecture Overview
COM Express architecture simplifies custom computer system design by integrating processing, memory, video, Ethernet, and USB functionalities into a compact module. These modules require carrier boards for application-specific I/O and external connectors.

COM Express Features
COM Express utilizes high-speed serial bus technology, including PCI Express, USB 2.0, Serial ATA, LVDS, and Serial DVO interfaces. It supports a range of processors, such as Core 2 Duo and ATOM, and offers low power designs that eliminate the need for cooling fans. Extended temperature models operate between -40°C to +85°C.

Benefits of COM Express Designs
  • Fast time to market
  • Scalability for upgrades
  • Application-specific I/O
  • Flexible mechanical configuration
  • Vibration resistance
  • Extended operating temperature
  • Long-term availability
  • Superior life cycle management

Custom Carrier Board Solutions
Custom carrier boards are designed to meet specific system requirements, offering improved noise immunity and easier signal routing. They can be tailored for specific I/O needs, making them ideal for legacy or proprietary equipment.

Sealevel's Custom Solutions
Sealevel provides comprehensive custom carrier board design, including electrical, mechanical, and software design, using advanced tools like Altium and SolidWorks. They ensure product compliance and certification to various standards.

Conclusion
Sealevel offers custom solutions that combine the convenience of COTS with tailored designs to meet specific customer needs. For more information, visit their Custom Solutions portal.
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Catalog excerpts

COM Express Custom Solutions-1

COM Express designs offer: > Fast time to market > Scalability for easy upgrade > Application specific I/O > Flexible mechanical configuration > Vibration resistance > Extended operating temperature > Long-term availability > Superior life cycle management Accelerate your new product design using a COM Express-based custom design from Sealevel. The COM Express architecture reduces the complexity, cost, and time required for custom computer system design by combining the processing, memory, video, Ethernet, and USB functionality in a small, highly-integrated module. COM Express modules are not meant to operate as stand alone, but instead install on carrier boards that provide the application specific I/O and external connectors best suited for the system requirements. Custom 1U Rackmount Computer Using COM Express A widely supported implementation of Computer on Module design, COM Express is based on the latest highspeed serial bus technology and incorporates PCI Express, USB 2.0, Serial ATA, LVDS, and Serial DVO interfaces. These high-speed buses combined with today’s fast, low-power processors provide the bandwidth needed for a wide variety of applications. Many companies provide modules that conform to the COM Express PICMG standard, enabling form-fit-function interchangeability and scalability. COM Express modules offer a variety of processor choices including powerful Core 2 Duo and popular ATOM designs. Low power designs eliminate the need for cooling fans, even with the fastest processors, greatly enhancing system reliability. Extended temperature models are available offering -40°C to +85°C operational temperature range. www.sealevel.com > Tel: 864.843.4343 > [email protected]

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COM Express Custom Solutions-2

COM Express Custom Solutions Custom Carrier Board Meeting technical specifications with off-the-shelf products may not be possible or may result in unacceptable performance, size, or cost constraints. A carrier board is tailored to meet all of the required system functionality to compliment the core features supplied by the COM Express module. The signals necessary to interface the I/O are brought down from the COM Express board via mating connectors, and the carrier board’s functionality and mechanical footprint are designed to best fit the application. Since low voltage differential signaling...

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