Vertical Transport with Clamping
Vertical Transport with Clamping
The document discusses the advantages of using vertical transport with clamping frames for the production of substrates and ultra-thin flexible materials. This method offers significant benefits such as high uniformity, no puddling effect, and identical process conditions on both sides of the substrate.
Key Features
- No puddling effect ensures symmetrical results on both sides of the substrate.
- High uniformity and shorter processing time compared to horizontal processing.
- Fully automatic clamping system adaptable for different panel sizes and thicknesses.
- MES interface available for all process-relevant parameters.
- Suitable for cleanroom applications.
Technical Specifications
- Maximum panel size: 610 mm x 610 mm.
- Panel thickness range: 0.025 mm to 2.4 mm.
- Maximum panel weight: 1.8 kg.
- Compatible panel materials include FR4, FR4 High Tg, BT, Polyimide, Re-enforced Polyimide, and PTFE.
Applications and Benefits
The system is developed by SCHMID in response to the demand for HDI circuit boards and substrates with fine structures. It supports various spraying processes such as cleaning, developing, stripping, flash etching, Ti etch, and MEC etch bond. The contact-free clamping system allows for direct application of medium without disturbing the spray pattern, achieving excellent results on both sides of the substrate. The system also features adjustable spray manifolds and flow rates for each nozzle string, enhancing chemical savings and uniformity.
Operational Efficiency
SCHMID's vertical production systems are designed for cleanroom applications, featuring separate working and maintenance areas. The fully automatic loading and unloading of clamping frames, along with an optional buffer system, ensures stable production with high throughput and increased yield.
Catalog excerpts
Vertical Transport with Clamping Frame Spraying processes without puddling effect The vertical transport with clamping frames offers decisive advantages for the production of substrates and ultra-thin flex materials. No puddling effect, the contact-free transport and identical process conditions on both sides ensure exceptionally high uniformity. The maintenance-friendly design and the robust, adaptable clamping system guarantee maximum availability. No puddling effect: Symmetrical results on both sides of the substrate Exceptionally high uniformity Shorter processing time compared to horizontal processing Fully automatic clamping system for different panel sizes and thicknesses MES interface for all process-relevant parameters Suitable for clean room app
Open the catalog to page 1
VERTICAL TRANSPORT WITH CLAMPING FRAME Technical Data Panel size: ■ max. 610 mm x 610 mm Panel thickness: ■ min. 0.025 mm ■ max. 2.4 mm Panel weight: ■ max. 1.8 kg Panel material: ■ FR4 ■ FR 4 High Tg ■ BT ■ Polyimide ■ Re-enforced Polyimide ■ PTFE Details In response to the demand for HDI circuit boards and substrates with extremely fine structures SCHMID developed the Vertical Transport with clamping frame, which is available for the following spraying processes: cleaning, developing, stripping, flash etching, Ti etch and MEC etch bond. The contact-free clamping system allows a direct application...
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