Vertical Transport with Clamping Frame Spraying processes without puddling effect The vertical transport with clamping frames offers decisive advantages for the production of substrates and ultra-thin flex materials. No puddling effect, the contact-free transport and identical process conditions on both sides ensure exceptionally high uniformity. The maintenance-friendly design and the robust, adaptable clamping system guarantee maximum availability. No puddling effect: Symmetrical results on both sides of the substrate Exceptionally high uniformity Shorter processing time compared to horizontal processing Fully automatic clamping system for different panel sizes and thicknesses MES interface for all process-relevant parameters Suitable for clean room app

VERTICAL TRANSPORT WITH CLAMPING FRAME Technical Data Panel size: ■ max. 610 mm x 610 mm Panel thickness: ■ min. 0.025 mm ■ max. 2.4 mm Panel weight: ■ max. 1.8 kg Panel material: ■ FR4 ■ FR 4 High Tg ■ BT ■ Polyimide ■ Re-enforced Polyimide ■ PTFE Details In response to the demand for HDI circuit boards and substrates with extremely fine structures SCHMID developed the Vertical Transport with clamping frame, which is available for the following spraying processes: cleaning, developing, stripping, flash etching, Ti etch and MEC etch bond. The contact-free clamping system allows a direct application...