Vertical processing with clamping frames The vertical processing of printed circuit boards and substrates using transport clamping frames opens up new possibilities. Not only the contact-less transport, but also the absolutely homogeneous treatment characterizes this machine type. Most different wet-chemical processes can be realized and can be easily integrated.

Technical Data Our new product series InfinityLine V + provides the answer to the questions of future-oriented technologies such as SAP and mSAP in serial production for the Advanced HDI and IC substrate markets. Panel sizes/dimensions:  0.025 mm - 2.4 mm  Minimum size: 18” x 18” (457 x 457 mm)  Maximum size: 24” x 24” (610 x 610 mm)  of transport clamping frames Use  Maximized yield through contact-less frame transport  Most homogeneous process results by vertical transport: no „puddling“  Clean room compatible (depending on equipment variant)  Individually configurable due to modular...