InfinityLine V+
InfinityLine V+
The InfinityLine V+ is a vertical processing machine for printed circuit boards and substrates, utilizing transport clamping frames for contact-less and homogeneous treatment. It supports various wet-chemical processes and is designed for integration into advanced manufacturing environments.
Key Advantages
- Maximized yield through contact-less frame transport.
- Homogeneous process results with vertical transport, eliminating puddling.
- Clean room compatibility, depending on equipment variant.
- Modular design allows individual configuration.
- Minimized footprint and readiness for Industry 4.0.
Technological Features
The InfinityLine V+ is tailored for future-oriented technologies like SAP and mSAP, particularly in the Advanced HDI and IC substrate markets. It features a unique modular concept developed by SCHMID, ensuring flexibility and investment security. The machine supports Industry 4.0 requirements with interfaces for production control systems (MES) and offers options for 6GEM interfaces. A web-enabled server interface allows system monitoring and control via mobile devices.
Technical Specifications
- Panel sizes range from 0.025 mm to 2.4 mm, with minimum and maximum dimensions of 18” x 18” (457 x 457 mm) and 24” x 24” (610 x 610 mm), respectively.
- Transport speed is adjustable from 0.2 to 6 m/min, handling 4 panels per minute.
- Automation options include integration into intralogistics systems and separate loader/unloader concepts.
Supported Processes
- Developing (Litho & SR)
- Flash-Etching
- Stripping (including amines)
- Pre-Treatment
- Ti-Etching
Contact Information
For more details, contact [email protected] or visit www.schmid-group.com.
Catalog excerpts
Vertical processing with clamping frames The vertical processing of printed circuit boards and substrates using transport clamping frames opens up new possibilities. Not only the contact-less transport, but also the absolutely homogeneous treatment characterizes this machine type. Most different wet-chemical processes can be realized and can be easily integrated.
Open the catalog to page 1
Technical Data Our new product series InfinityLine V + provides the answer to the questions of future-oriented technologies such as SAP and mSAP in serial production for the Advanced HDI and IC substrate markets. Panel sizes/dimensions: 0.025 mm - 2.4 mm Minimum size: 18” x 18” (457 x 457 mm) Maximum size: 24” x 24” (610 x 610 mm) of transport clamping frames Use Maximized yield through contact-less frame transport Most homogeneous process results by vertical transport: no „puddling“ Clean room compatible (depending on equipment variant) Individually configurable due to modular...
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