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Edge Isolation + PSG Etching

Edge Isolation + PSG Etching

Edge Isolation + PSG Etching

Product catalog summary
Overview: The Edge Isolation + PSG Etching Inline System by SCHMID is designed for efficient edge isolation in solar cell manufacturing. It features a specialized transport system that minimizes chemical usage and employs a patented water mask for optimal emitter isolation.
Key Features:
  • Single-sided edge isolation for enhanced efficiency.
  • Patented water mask ensures stable processes without the need for a cooling unit.
  • Easy maintenance with good accessibility and cleaning processes, especially for PERC cells.
  • Compatible with selective emitter technology.
Process Description: The system integrates multiple process steps, including the isolation of the emitter layer on the wafer's rear side and the removal of phosphorous silicate glass (PSG) from the surface. The water mask protects the emitter during edge isolation, and special transport rollers limit chemical contact to the rear side, reducing consumption.
Technical Specifications:
  • Throughput: 3,600 wafers/h (5 tracks) or 7,200 wafers/h (10 tracks), with configurable options.
  • Wafer Size: 156 - 161.7 mm.
  • Breakage Rate: Less than 0.1%.
  • Process Media: HF, KOH, HNO3.
  • Automation: Optional loader and unloader available.
Benefits: The system's modular design allows for customization of throughput and process steps to meet specific customer needs. The use of multiple cascade technology reduces DI water consumption, and the modified conveyor system prevents organic contamination of wafers.
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Catalog excerpts

Edge Isolation + PSG Etching-1

Edge Isolation + PSG Etching Single-sided edge isolation for maximum efficiency The Edge Isolation + PSG Etching Inline System fully automatically achieves a perfect edge isolation. The transport system developed by SCHMID especially for edge isolation ensures low chemistry consumption. In combination with the patented water mask the emitter is optimally isolated.

 Open the catalog to page 1
Edge Isolation + PSG Etching-2

Expect Solutions Details Technical Data Throughput: ■ 3,600 wafers/h (5 tracks) ■ 7,200 wafers/h (10 tracks) ■ Further throughputs configurable Wafer Size: ■ 156 - 161,7 mm Breakage rate: ■ < 0,1 % Process media: ■ HF ■ KOH ■ HNO3 Automation: ■ Optional Loader and Unloader The Edge Isolation + PSG Etching Inline System combines several process steps in one system with modular design. On the one hand the emitter layer on the rearside of the wafer generated during the diffusion process is unilaterally isolated from the front side of the wafer in order to prevent malfunction of the solar cell. On...

 Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.