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MicroGraph System Data Sheet

MicroGraph System Data Sheet

Product catalog summary

Concept
The MicroGraph System (MGS) is designed for efficient crimp cross-sectional analysis, significantly reducing the time required compared to traditional methods. It combines sawing, polishing, and innovative electrolyte staining processes with high-precision optics to produce high-quality images for analyzing electrical connections such as crimped, welded, soldered, or spliced connections. The system is modular, allowing customization based on specific needs, and can be integrated into mobile carts for a portable quality station.

Applications
The system is suitable for standard crimp, machined contact/indent crimp, ultrasonic and resistance welding, and potting for cutting complete connectors like IDC.

Specifications
Detailed specifications are available in individual datasheets.

Special Features

MicroGraph System (MGS): Offers modularity for various applications and integrates with Schleuniger CrimpCenter software. It can be configured as a table, cart, or standalone device.
SawPolish Unit (SPU): Available in SPU 6 and SPU 60 for processing wires up to 6 mm² and 60 mm², respectively. Features in-line saw and polish discs, a carbide cutting blade, and various blade widths.
MacroZoom Unit 1.3 (MZU): Equipped with a 2.0 USB camera with 1.3 Megapixel resolution, 9 zoom positions, and optional auxiliary lens. It uses CrimpLab software for measurement and reporting.
ElectrolyteStaining Unit (ESU): Provides a safe staining solution with a pH of 7, instant process feedback, and multiple pen sizes for different sample sizes.

Note: Technical specifications are subject to change.

Catalog excerpts

MicroGraph System Modular System for Crimp Cross Section Analysis QUALITY ASSURANCE

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MicroGraph System Concept Crimp cross sectional analysis has quickly become an integral part of the crimp quality process. With the MicroGraph System (MGS), crimp cross-sectional images can created in a fraction of the time compared to conventional methods. The combined sawing-polishing process, innovative electrol te staining process, and high precision optics result in high quality images for thorough analysis of the connection. Electrical connections (e.g. crimped, welded, soldered or spliced) can be cut (sawn), polished, stained (cleaned), and visually analyzed. The system includes modular...

Open the catalog to page 2

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