
SEMICONDUCTOR RELIABILITY TESTING THERMAL CYCLING TEST SYSTEM Dual-head system for semiconductor reliability −80°C to +225°C Test two devices simultaneously DUAL TEST-HEAD CONFIGURATION Localized thermal cycling Direct clean, dry air to each device for parallel temperature testing. MOTORIZED HEAD POSITIONING Vertical lift and pneumatic actuation System airflow output Temperature control IC packages · Optical modules · Automotive electronics Rapid thermal cycling for component reliability and failure analysis Discuss your test requirements DISCUSS YOUR THERMAL TEST NEEDS www.sanwood.us info@
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