SEARAY LP High Speed/High Density Systems
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Low Profile Open Pin Field Arrays SEARAYTM LP High Speed/High Density Systems Samtec’s SEARAY™ LP supports high speed applications that require reliable, high pin count solutions in a low profile design. This system is available in 4 mm, 4,5 mm and 5 mm mated heights with up to 320 total pins in 4, 6 or 8 row configurations. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Open Pin Field Flexibility Single-Ended Up to 28+ Gbps SEARAY™ LP high speed low profile arrays (LPAM/LPAF Series) feature a dual beam contact system on a 1,27 mm x 1,27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. Standard lead-free solder charge simplifies IR reflow terminations and improves solder joint reliability. Optional pick and place pads are available for automated placement on the PCB. Other pin counts, row counts and gold plating options are also available for additional design flexibility. Differential Pair Up to 28+ Gbps Features: • 4 mm, 4,5 mm and 5 mm stack heights • Up to 40 pins per row • 4, 6 or 8 row • Dual beam contact system • Solder crimped termination for ease of processing • Supports 28+ Gbps high speed applications Connectors Socket: LPAF No. of positions x (1,27) .050 + (5,15) .203 Terminal: LPAM No. of positions x (1,27) .050 + (6,76) .266 LPAF LPAM MATED HEIGHT MATED HEIGHT LEAD STYLE LEAD STYLE LPAF LEAD STYLE LPAM LEAD STYLE *Processing conditions will affect mated height. For more High Density Solutions, please visit samtec.com/arrays UNITED STATES • NORTHERN CALIFORNIA • SOUTHERN CALIFORNIA • SOUTH AMERICA • UNITED KINGDOM • GERMANY • FRANCE • ITALY • NORDIC/BALTIC BENELUX • ISRAEL • INDIA • AUSTRALIA / NEW ZEALAND • SINGAPORE •