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SEARAY HIGH-SPEED/HIGH-DENSITY SYSTEMS

SEARAY HIGH-SPEED/HIGH-DENSITY SYSTEMS

SEARAY HIGH-SPEED/HIGH-DENSITY SYSTEMS

Product catalog summary
Overview: The SEARAY™ High-Speed/High-Density Systems document provides detailed specifications and options for open-pin-field arrays designed for high-performance electronic applications. These systems are characterized by a .050" (1.27 mm) pitch grid, offering flexibility in routing and supporting up to 36 Gbps performance.
Product Specifications:
  • SEAM & SEAF: Open-pin-field terminal and socket with 36 Gbps performance, available in stack heights from 7 to 17.5 mm.
  • SEAMP & SEAFP: Press-fit terminals and sockets with performance up to 24 Gbps and 23 Gbps respectively, featuring guide post options.
  • SEAM-RA & SEAF-RA: Right-angle terminals and sockets with performance up to 26 Gbps, offering latching and guide post options.
  • SEAR: Elevated riser with 21 Gbps performance and stack heights up to 40 mm.
  • SEAC: High-speed cable assembly supporting 50 Ω coax or 100 Ω twinax cable configurations.
  • SEAMI: 85 Ω tuned terminal with 33 Gbps performance and stack heights up to 17.5 mm.
Performance and Applications:
  • Supports up to 500 single-ended I/Os or 125 differential pairs.
  • Rugged Edge Rate® contact system minimizes damage during unmating.
  • Compatible with VITA 42, VITA 57, VITA 57.4 standards.
  • Meets IPC-A-610F and IPC J-STD-001F Class 3 solder joint standards.
Additional Solutions:
  • UBPT/UBPS: 20 A discrete power modules with press-fit, right-angle socket and vertical terminal.
  • JSO: Precision board stacking jack screw standoffs to assist unmating and reduce component damage.
For more SEARAY™ solutions, visit www.samtec.com/searay.
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Catalog excerpts

SEARAY HIGH-SPEED/HIGH-DENSITY SYSTEMS-1

OPEN-PIN-FIELD ARRAYS SEARAY™ HIGH-SPEED/HIGH-DENSITY SYSTEMS • .050" (1.27 mm) pitch grid for maximum routing flexibility • Up to 500 single-ended I/Os or 125 differential pairs • Up to 36 Gbps performance • Rugged Edge Rate® contact system less prone to damage when “zippered” during unmating • 7 to 40 mm stack heights • Parallel, perpendicular, and coplanar applications • Solder on each tail for ease of processing • High-speed cable assemblies for 50 Ω or 100 Ω solutions • Press-fit tails available • VITA 42, VITA 57, VITA 57.4 • IPC-A-610F and IPC J-STD-001F Class 3 solder joint Open-Pin-Field Flexibility Single-Ended Up to 36 Gbps Differential Pair Up to 36 Gbps SEARAY™ PRODUCTS • SEAM – .050" Pitch Array Terminal • SEAF – .050" Pitch Array Socket • SEAM-RA – Right-angle, .050" Pitch Array Terminal • SEAF-RA – Right-angle, .050" Pitch Array Socket • SEAMP – Press-fit, .050" Pitch Array Terminal • SEAFP – Press-fit, .050" Pitch Array Socket • SEAFP-RA – Right-angle Press-fit, .050" Pitch Array Socket • SEAMI – 85 Ω Tuned, .050" Pitch Array Terminal • SEAR – Elevated Riser, .050" Pitch Array • SEAC – .050" Pitch Array Cable Assembly

 Open the catalog to page 1
SEARAY HIGH-SPEED/HIGH-DENSITY SYSTEMS-2

SEARAY PRODUCT SOLUTIONS ™ Open-Pin-Field Terminal Right-Angle Terminal Open-Pin-Field Socket Right-Angle Socket 36 Gbps performance; stack heights from 7 to 17.5 mm 24 Gbps performance; guide post option 36 Gbps performance; stack heights from 7 to 17.5 mm 26 Gbps performance; latching post option Press-Fit Terminal Press-Fit Socket Right-Angle Press-Fit Socket 24 Gbps performance; guide post option 23 Gbps performance; stack heights up to 16 mm Press-fit tails; guide post option Elevated Riser High-Speed Cable Assembly 33 Gbps performance; stack heights up to 17.5 mm 21 Gbps performance; elevated...

 Open the catalog to page 2
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