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SDRAM Product Guide

SDRAM Product Guide

Product catalog summary

SDRAM Component Ordering Information
This section outlines the specifications for ordering SDRAM components, including density options from 16Mb to 1Gb, configurations such as x4, x8, and x16, and a 3.3V LVTTL interface. Package types include TSOP II and sTSOP II, with lead-free options available.

SDRAM Component Product Guide
The guide details SDRAM components by density and die type (H-die, E-die, F-die) for both commercial and industrial temperatures. It includes part numbers, power specifications, and emphasizes backward compatibility with PC100 standards.

Lead-Free SDRAM Component Product Guide
This section focuses on lead-free SDRAM components, ensuring compatibility with PC100 standards. It provides speed descriptions, temperature, and power specifications, with package types like TSOP II and sTSOP II.

Industrial Temperature SDRAM Component Product Guide
This guide is dedicated to SDRAM components suitable for industrial temperatures, offering part numbers, power specifications, and package types for both normal and low power options.

SDRAM Module Ordering Information
Provides details on ordering SDRAM modules, including DIMM and SODIMM configurations, data bits, features, speed, refresh rates, bank configurations, and interface types.

SDRAM Module Product Guide
Offers comprehensive information on SDRAM modules, covering organization, density, part numbers, speed, composition, power, and availability for registered and unbuffered DIMMs and SODIMMs.

Package Dimension
Concludes with detailed package dimensions for TSOP II packages, including measurements and tolerances for precise component integration.

Catalog excerpts

General Information SDRAM February. 2004 >

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Speed Package TypeTemperature & Power RevisionBankOrganizationDensity & RefreshProductDRAMSAMSUNG MemoryInterface (V > DD , V > DDQ ) : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. 3. Product4. Density & Refresh5. Organization 6. Bank7. Interface ( V : 6th Gen. S : SDRAM : 7th Gen : 9th Gen CLIPEN 9. Package Type 8. Revision 11. Speed (Default CL= 3) 1. SAMSUNG Memory : K2. DRAM : 4 16 : 16Mb, 4K/64ms64 : 64Mb, 4K/64ms28 : 128Mb, 4K/64ms56 : TSOP II : TSOP II (Lead Free) : 256Mb, 8K/64ms51 : sTSOP IIUV : sTSOP II (Lead Free) : 512Mb, 8K/64ms04 10. Temperature & Power : : x 406 Commercial/Normal...

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Speed Power PCB revision & TypeComponent RevisionRefresh, # of Banks in Comp. & InterfaceDepthFeatureData bitsDIMM Configuration Memory ModulePackage 1. Memory Module : M2. DIMM Configuration3. Data Bits 4. Feature5. Depth 12. Speed (Default CL= 3 )11. Power10. PCB Revision & Type9. Package 8. Component Revision Composition Component 7. Composition Component : x 43 : x 84 : x168 3 : DIMM 4 : x 4 Stack (Flexframe)9 : SODIMM : x 8 Stack (Flexframe) :::: 63: x63 PC100 / PC133 SODIMM with SPD for 144pin 64: x64 PC100 / PC133 SODIMM with SPD for 144pin (Intel/JEDEC) 66: x64 Unbuffered DIMM with SPD...

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General Information SDRAM February. 2004 > juyeonmcshineykong [email protected], Tel : [email protected], Tel : 82-31-208-6435 @sec.samsung.com, Tel : 82-31-208-6436 @sec.samsung.com, Tel : [email protected], Tel : 82-31-208-6432 ( 16Mb, 64Mb, 128Mb SDR )( 256Mb, 512Mb SDR )( 256Mb, 512Mb SDR )( Datasheet )( General ) size="-1">

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SDRAM Product Guide

SDRAM Product Guide

Catalog excerpts

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