Memory & Storage Product Selection Guide
28Pages

.ON GUID Samsung Semiconductor, Inc. MEMORY & STQRAGE

Samsung Semiconductor, Inc. Samsung offers the industry's broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM products are found in computersfrom ultra-mobile portables to powerful serversח and in a wide range of handheld devices such as smartphones and MP3 players. Samsung also delivers the industry's widest line of storage products. These include optical and hard disk drives as well as flash storage, such as the all-flash Solid State Drive and a range of embedded and removable flash storage products. Markets DRAM...

DRAM Pages 4-13 ^^^^^^ www.samsung.com/semi/dram Graphics DDR SDRAM Օ DDR3 SDRAM DRAM Ordering Information Օ DDR2 SDRAM DDR SDRAM Օ SDRAM Mobile SDRAM Օ RDRAM 2 < oc FLASH_Pages 14-16 www.samsung.com/semi/flash SLC Flash Օ MLC Flash SD and microSD Cards Օ Flash Ordering Information to < _l HIGH SPEED SRAM Pages 17-20 www.samsung.com/semi/sram Asychronous Օ Synchronous NtRAMՙ Late-Write R-R SRAM Օ DDR / II / II+ SRAM QDR / II / II+ SRAM 2 < OC to MULTI-CHIP PAcKAGE Pages 21-22 www.samsung.com/semi/mcp Օ NOR & UtRAM NAND & DRAM Օ NOR & DRAM OneNAND & DRAM Օ Flex-OneNAND & DRAM OneNAND &...

AM ORDERING INFOI 1 2 3 4 5 6 7 8 9 10 11 K 4 T XX XX X X X X X XX 2 < oc DRAM DRAM Type Revision Density Interface (VDD, VDDQ) Bit Organization Number of Internai Banks 1. Memory (K) 08: x8 15: x16 (2CS) 16: x16 26: x4 Stack (JEDEC Standard) 27: x8 Stack (JEDEC Standard) 30: x32 (2CS, 2CKE) 31: x32 (2CS) 32: x32 9. Package Type 2. DRAM: 4 DDR SDRAM L: TSOP II (Lead-free & Halogen-free) H: FBGA (Lead-free & Halogen-free) F: FBGA for 64Mb DDR (Lead-free & Halogen-free) 6: sTSOP II (Lead-free & Halogen-free) T: TSOP II N: sTSOP II G: FBGA U: TSOP II (Lead-free) V: sTSOP II (Lead-free) Z: FBGA...

ERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 12 13 M X XX T XX X X X X X X XX X 2 < oc DIMM _| Data bits DRAM Component Type Depth Number of Banks Bit Organization Speed PCB Revision Package Component Revision 1. Memory Module: M 5. Depth 9. Package 09: 8M (for 128Mb/512Mb) E: FBGA QDP (Lead-free & Halogen-free) 17: 16M (for 128Mb/512Mb) G: FBGA 16: 16M H: FBGA (Lead-free & Halogen-free) 28: 128M J: FBGA DDP (Lead-free) 29: 128M (for 128Mb/512Mb) M: FBGA DDP (Lead-free & Halogen-free) 32: 32M N: sTSOP 33: 32M (for 128Mb/512Mb) Q: FBGA QDP (Lead-free) 51: 512M T: TSOP II (400mil) 52: 512M (for...

MLC FLASH MOQ Type Family Density Technology Part Number Package Type Org. Vol(V) Tray T/R Comments -xxxxxx -xxxTxx 32Gb Mono 27nm K9HDG08U1A-SCB0 TSOP - Lead free & Halogen free x8 3.3 960 1000 32Gb Based 64Gb DDP 27nm K9LCG08U0A-SCB0 TSOP - Lead free & Halogen free x8 3.3 960 1000 128Gb QDP 27nm K9GBG08U0A-SCB0 TSOP - Lead free & Halogen free x8 3.3 960 1000 2bit 16Gb Mono 32nm K9GAG08U0E-SCB0 TSOP - Lead free & Halogen free x8 3.3 960 1000 16Gb Based 32Gb DDP 32nm K9LBG08U0E-SCB0 TSOP - Lead free & Halogen free x8 3.3 960 1000 64Gb QDP 32nm K9HCG08U1E-SCB0 TSOP - Lead free & Halogen free...

UCT ORDERING INFORMATI 1 2 3 H 1 5 6 ■ 8 9 10 11 12 13 14 15 K 9 X X X X X X X X - X X X X ustomer Bad Block Small Classification Temp Density Package Density Organization Generation Organization Mode Vcc 1. Memory (K) 8. Vcc 13. Temp 2. NAND Flash : 9 A : 1.65V~3.6V B : 2.7V (2.5V~2.9V) C : 5.0V (4.5V~5.5V) D : 2.65V (2.4V~2.9V) E : 2.3V~3.6V R : 1.8V (1.65V~1.95V) Q : 1.8V (1.7V~1.95V) T : 2.4V~3.0V U : 2.7V~3.6V V : 3.3V (3.0V~3.6V) W : 2.7V~5.5V, 3.0V~5.5V 0 : NONE C : Commercial I : Industrial 0 : NONE (Containing Wafer, CHIP, BIZ, Exception handling code) 3. Small Classification (SLC...

US SRAM ORDERING INFORI 1 2 3 H 1 5 6 1 8 9 10 11 12 13 14 15 16 K 7 X X X X X X X X - X X X X X Small Classification Density Temp, Power Density Package Organization Organization Generation Vcc, Interface, Mode Vcc, Interface, Mode 1. Memory (K) 49: 2.5V,LVTTL,Hi SPEED 52: 2.5V,1.5/1.8V,HSTL,Burst2 54: 2.5V,1.5/1.8V,HSTL,Burst4 62: 2.5V/1.8V,HSTL,Burst2 64: 2.5V/1.8V,HSTL,Burst4 66: 2.5V,HSTL,R-R 74: 1.8V,2.5V,HSTL,All 82: 1.8V,HSTL,Burst2 84: 1.8V,HSTL,Burst4 88: 1.8V,HSTL,R-R T2: 1.8V,2Clock Latency,Burst2 T4: 1.8V,2Clock Latency,Burst4 U2: 1.8V,2.5Clock Latency,Burst2 U4: 1.8V,2.5Clock...

moviNAND moviNAND combines high-density MLC NAND Flash with an MMC controller in a single chip that has an MMC interface. moviNAND delivers dense, cost-effectice storage for embedded applications. Density Package Type Org. Vol (V) 2GB FBGA x8 1.8/3.3 4GB FBGA x8 1.8/3.3 8GB FBGA x8 1.8/3.3 16GB FBGA x8 1.8/3.3 32GB FBGA x8 1.8/3.3 64GB FBGA x8 1.8/3.3 Remarks MMC 4.3 & MMC 4.4 Contact your local Samsung rep for availability and ordering information. Please contact your local samsung sales representative for the latest product offerings. Note: All parts are lead free OneDRAMٙ QneDRAM is a...

BD-COMBO Interface Speed Type Loading Lightscribe Medel BD ROM READ 8X H/H Tray X TS-HB33A / SH-B083A O TS-HB33L/SH-B083L BD ROM READ 12X H/H Tray X TS-HB43A / SH-B123A O TS-HB43L/ SH-B123L SATA TS-LB23A / SN-B043A X TS-LB23B BD-ROM READ 4X Slim Tray TS-LB23D O TS-LB23L / SN-B043L TS-LB23P Slot O TS-TB23L DVD-W Interface Speed Type Loading Lightscribe Medel DVD Write 22X H/H Tray X TS-H653G SATA DVD Write 20X H/H Tray X TS-H653H DVD Write 20X H/H Tray X TS-H653J PATA DVD Write 22X H/H Tray X TS-H662A / SH-S222A DVD Write 22X H/H Tray X TS-H663C / SH-S223C SATA DVD Write 24X H/H Tray X...

DVD-W Slim Externa! Interface Speed Type Loading Lightscribe Medel Slim Tray X SE-S084C USB 2.0 DVD Write 8X Ultra Slim Tray X SE-S084D Slim Tray X SE-S084F Slot O SE-T084P DVD-ROM Interface Speed Type Loading Lightscribe Medel DVD 16X H/H Tray X TS-H353C / SH-D163J SATA DVD 8X Slim Tray X TS-L333B TS-L333D DVD 8X Utra Slim Tray X TS-U333A DVD-W Loader Interface Speed Type Loading Lightscribe Medel PATA DVD 8X H/H Tray X TS-P632F LU CD < OC I www.samsungodd.com 2H 2010 Optical Disk Drives 27