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All Product Selection Guide

All Product Selection Guide

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All Product Selection Guide

Product catalog summary

Memory and Storage

DRAM: Various types including DDR3, DDR2, DDR, SDRAM, RDRAM, and Mobile SDRAM are detailed with configurations and speeds.
Flash Memory: Covers NAND, OneNAND, and NOR Flash, with specific ordering information for NAND Flash.
SRAM: Discusses different types such as Asynchronous, Low-Power, and High-Speed SRAM, with ordering details.
Multi-Chip Packages: Combines technologies like NAND/DRAM and NOR/SRAM.
Storage Solutions: Includes specifications for Hard Disk Drives and Optical Storage Solutions.

System LSI

ASICs: Application-specific integrated circuits with ordering information.
LCD Driver ICs: Includes ordering information for various driver ICs.
Mobile Application Processors: Details on processors for mobile applications.
CMOS Image Sensors: Information on image sensors for various applications.
Microcontrollers: Includes ordering information for microcontrollers.
Serial EPROMS: Details on serial EEPROMs.

TFT-LCD

Monitor/Industrial LCD Panels: Sizes range from 15" to 30".
LCD TV/A.V.: HD and Full HD options available in various sizes.
Mobile Phones: Main and external displays for mobile phones.
Information Displays: Large displays ranging from 40" to 82".
Digital Imaging and Entertainment: Includes DSC/DVC, photo printers, PMP, VOIP, and games.
Mobile AV: Mini PCs, CNS, Car TVs, and P-DVDs.
Industrial Applications: Various industrial display applications.

DDR2 SDRAM Registered Modules

Details on parity, density, organization, speed, part numbers, and package types for modules ranging from 512MB to 4GB.
Notes on voltage requirements and module height.

DDR2 SDRAM Fully Buffered Modules

Specifications for modules from 512MB to 4GB, including speed, part numbers, and package details.
Notes on voltage and module height.

DDR3 SDRAM Components

Details on package, density, organization, speed, part numbers, and package dimensions for components ranging from 512Mb to 1Gb.
Notes on voltage and speed classifications.

DDR3 SDRAM Unbuffered Modules

Specifications for modules from 256MB to 2GB, including speed, part numbers, and package details.
Notes on voltage and speed classifications.

Overview: This document provides detailed specifications and production status for various types of Synchronous SRAM products manufactured by Samsung Semiconductor, Inc. as of September 2006. The document categorizes the SRAM products based on their architecture, density, organization, voltage, and package type.

Main Sections:

NtRAM (4Mbit) SRAM: Lists products with part numbers K7N403601B and K7N401801B, detailing their organization, operating mode, voltage, access time, cycle time, and production status.
LATE-WRITE R-R (16Mbit and 32Mbit) SRAM: Describes products such as K7P161866A and K7P321888M, with specifications including access time, cycle time, and package type.
DDR (16Mbit and 8Mbit) SRAM: Includes products like K7D161874B and K7D803671B, highlighting their access time, cycle time, and production status.
DDR II CIO/SIO (18Mbit and 36Mbit) SRAM: Lists products such as K7I161882B and K7I321882M, with details on their access time, cycle time, and production status.
QDR I, II (18Mbit and 36Mbit) SRAM: Covers products like K7R160982B and K7R320982M, providing specifications on access time, cycle time, and production status.
Ordering Information: Provides a detailed breakdown of the part numbering system, explaining the significance of each digit in the part number.
MCPs (Multi-Chip Packages): Lists combinations of NAND and DRAM memory, detailing their density, voltage, organization, and package information.

Key Specifications:

Voltage: Products operate at various voltages, including 1.8V, 2.5V, and 3.3V.
Access Time: Ranges from 0.45ns to 6.5ns depending on the product type.
Cycle Time: Products support cycle times up to 500MHz.
Package Types: Include 100TQFP, 119BGA, 153BGA, and 165FBGA.
Production Status: Most products are in mass production, with some marked as EOL or scheduled for future production.

Conclusion: The document serves as a comprehensive guide for selecting Samsung's Synchronous SRAM products, providing essential technical specifications and production details to aid in decision-making for various applications.

Memory and Storage Overview

MCPs (Multi-Chip Packages)
This section details various MCP configurations combining NAND, DRAM, OneNAND, NOR, SRAM, and UtRAM technologies. Key specifications include voltage requirements, organization, and package dimensions.

Hard Disk Drives (HDD)
Specifications for 3.5” and 2.5” HDDs, including capacity, RPM, interface type, buffer size, seek time, and MTBF. The SpinPoint series is highlighted.

Optical Storage
Specifications for optical drives such as SN-M242D, SN-S082D, SH-S182M, and SH-S182D are provided. Key features include drive speed, supported disc types, and media capacity.

System LSI
This section covers ASICs, LCD driver ICs, mobile application processors, CMOS image sensors, microcontrollers, and serial EPROMS. The technology library details core voltage, I/O voltage tolerance, and maximum drive voltage for different ASIC technologies.

Notes
1. Part numbers include specific codes indicating features like tape and reel packaging.
2. (D) denotes DDR SDRAM, and (L) denotes Large Block NAND in MCPs.
3. All NOR Flash have demuxed Add/Data lines unless specified otherwise.

Package Types and Pin Configurations
This section outlines various package types and their corresponding pin configurations. It includes types such as PLCC, QFP, SOP, TQFP, and others, with specific pin counts for each type.

Packing Methods
Different packing methods are specified, including Tube, Bulk, Tray, Tape & Reel, and variations for Pb-Free packages.

ROM Size Specifications
The document lists ROM sizes ranging from 0K byte to 1M byte, with special markings for military and industrial applications.

EEPROM Specifications
This section provides details on EEPROMs, including part numbers, density, write protection methods, operating voltage, write time, interface type, and package.

TFT-LCD Monitor and Industrial Panels
The document details specifications for various TFT-LCD panels used in monitors and industrial applications.

HD and Full-HD LCD TV Specifications
Specifications for HD and Full-HD LCD TVs are provided, covering sizes from 23" to 57".

Mobile Phone Displays
This section outlines specifications for mobile phone displays, including main and external displays.

Information Displays
Information display applications are detailed for sizes 40" to 82".

Digital Imaging and Entertainment
The document briefly mentions digital imaging applications, including DSC, DVC, photo printers, PMP, VOIP, and games.

Overview: This document provides detailed specifications for various TFT-LCD displays used in mobile AV applications, including Mini PCs, Car TVs, and Industrial Applications.

Specifications:

Display Sizes: Range from 1.82 inches to 12.0 inches.
Resolution: Varies from 128xRGBx160 to 800xRGBx480, depending on the model.
Display Modes: Include TMR, mSWV+, and Transflective.
Display Colors: Options include 65K, 262K, and 16.7M colors.
Interfaces: Include CPU, 8bit RGB, 6bit RGB, and 24 bit RGB I/F.
Brightness: Ranges from 170 cd/m² to 450 cd/m².
Contrast Ratio: Ranges from 200:1 to 500:1.
Power Consumption: Panel power consumption ranges from 25 to 957, while B/L power consumption ranges from 150mW to 6.84W.
Light Source: Primarily LED, with some models using CCFL.
Temperature Range: Storage temperature ranges from -30°C to 70°C, and operation temperature ranges from -20°C to 70°C.

Production and Availability:

All models are available for mass production, with some models having specific production quarters noted.

Notes: Specifications are subject to change without prior notice. For more information, visit Samsung's official websites.

Catalog excerpts

September 2006 Product Selection Guide >

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DOS MP NPN 256M64Mx4266K4H560438H-UC(L)B066 pin TSOPPb-free 256M64Mx4333/400K4H560438H-ZC(L)CC/B360 ball FBGAPb-free 256M32Mx8333/400K4H560838H-UC(L)B3/CCC66 pin TSOPPb-free 256M32Mx8333/400K4H560838H-ZC(L)B3/CCC60 ball FBGAPb-free 256M16Mx16333/400K4H561638H-UC(L)/B3/CCC66 pin TSOPPb-free 256M16Mx16333/400K4H561638H-ZC(L)B3/CCC60 ball FBGAPb-free 512M128Mx4266K4H510438C-UC(L)B066 pin TSOPPb-free 512M128Mx4266K4H510438D-UC(L)B066 pin TSOPPb-free 512M128Mx4333/400K4H510438C-ZC(L)B3/CCC60 ball FBGAPb-free 512M128Mx4333/400K4H510438D-ZC(L)B3/CCC60 ball FBGAPb-free 512M64Mx8266/333/400K4H510838C-UC(L)B0/B3/CCC66...

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K - .M K .V .T .NAND F:.S C SLC:S L CMLC: C:5.0V(4.5V~5.5V) D:2.65V(2.4V~2.9V) E:2.3V~3.6V Q:1.8V(1.7V~1.95V) T:2.4V~3.0V U:2.7V~3.6V V:3.3V(3.0V~3.6V) W:2.7V~5.5V,3.0V~5.5V 0:NONE C:Commercial I:Industrial0:NONE .B B M L CSM:SMS/B:S B B:Include Bad BlockD:Daisychain Sample L:1~5 Bad Block N:Ini.All Good,Add.10 Blocks S:All Good Block 0:NONE A:SLC + Muxed I/F ChipB:Muxed I/F Chip S:SLC Single SM D:SLC Dual SM Q:4CHIP SM T:SLC SINGLE (S/B) E:SLC DUAL (S/B) R:SLC 4DIE STACK (S/B) F:SLC Normal G:MLC Normal K:SLC 2-Die Stack W:SLC 4-Die Stack J:Non-Muxed OneNAND U:2 STACK MSP V:4 STACK MSP .M .NAND-R...

Open the catalog to page 13

O O SP DP NOV VSTC AC APS M K6X8008C2B1Mx84.5 - 5.555,70C,I5050TSOP2(44)EOL K6X8016C3B512x164.5 - 5.555,70C,I6050TSOP2(44)EOL M K6X4016C3F256x164.5 - 5.555,70I,A5020,30TSOP2(44)EOL K6X4008C1F512x84.5 - 5.555,70I,A4020,3032SOP,TSOPEOL M K6T1008C2E128x84.5 - 5.555,70C,I501032DIP,32SOP,TSOP1(32)EOL K6X1008C2D128x84.5 - 5.555,70I,A3515,2532SOP,TSOP1(32)EOL K K6T0808C1D32x84.5 - 5.555,70C,I60528SOP,TSOP1(28)EOL K6X0808C1D32x84.5 - 5.555,70C,I352528SOPEOL > NOTELead-ee aaae n eest O O SP DP NOV VS TC AC APS M K6F1616U6C1x162.7 - 3.355,70I3148-FBGAEOL,LTB due no later than 12/31/06 K6F1616R6C1x161.65...

Open the catalog to page 14

B S S T A D S S D M C > Horizontal/vertical drive mounting Solenoid tray loading Dimensions (WxHxD in mm): 148.2 x 42 x 170 Interface:P-ATA2MB buffer memory CD-ROM/R/RW:110ms DVD-Single:130ms DVD-Dual:140ms DVDR/RW:140ms Read DVD-ROM Max.16X (21,600KB/sec) SpeedDVD-RAM Max.12X (16200KB/sec)DVD-Dual DVDѱRW Max.8X (10,800KB/sec) DVDR Max.12X (16,200KB/sec)DVDѱR DL Max.8X (10,800KB/sec)CD-ROM Max.48X (7,200 KB/sec) CD-R/CD-RW Max.40X (6,000 KB/sec)Write DVD-RAM Max.12X (16,200 KB/sec) SpeedDVD+R Max.18X (24,300KB/sec)DVD-R Max.18X (24,300KB/sec) DVDRW Max.8X (10,800KB/sec),6X (8,100KB/sec)DVDѱR...

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SECTION BPAGE ASICs > 3b 5b6b7b ֖ 8b9b10b 10b11b-14b15b16b ASIC ORDERING INFORMATION LCD DRIVER ICs LCD DRIVER IC ORDERING INFORMATION MOBILE APPLICATION PROCESSORS CMOS IMAGE SENSORS MICROCONTROLLERS MICROCONTROLLER ORDERING INFORMATION SERIAL EPROMS >

Open the catalog to page 30

I/O LIBRARY . ..----.--- STD /STDMSTDSTDSTDHSSTDGSTDLP I/OCMOS,TTL I/O Buffers AAAAAA I/O-IP3/5V tolerantAAAAAA Slew controlAAAAAA PVT impedance controlNAGGGGG True 5V I/OANANANANANA AGP4XNANANANANANA ATA5AAARARARAR ATA6NANAARGARAR CardBus/PCIARARARARARAR GTLAARARGGG HSTLGGARGGG IEEE1284ANANANANANA LVDSGARARARARAR OSC (KHz)AAAAAA OSC (MHz)AAAAAA PCIAAARARARAR PECLAR ARARGGG SSTLAR AARARARAR Ultra2- SCSI (LVD)DNANANANANA USB1.1AAAAAA > NOTES I/O ee seet (I/O nteae I/O-IP ee seet n NCTS (Ne Ce Taee Seet)1A Aaae6E Unde deeent (desn and at e nsed te date) 2AR Aaae n Reest7F Seded (desn and at e nsed...

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STD STDMDLSTDSTDLSTDHSTDSTDLLL LDLLLLHSLGLLP HDHDLPHDHDLPHDLPHDLPHDLPHDLP SPSRAMAAAAAAAAANAAAARA SPSRAMBWAANAAAAAAANAAAARA SPSRAMRNANANANAANAANAANAAAARA DPSRAMAAAAAAAAANAAAARA DPSRAMBWNANANANAAAAAANAAAARA DPSRAMRNANANANANANANANAANAAAARA SPARAMAAANANANANANANANANANAARNA SPARAMBWNANANANAANAANANANANANAARNA ARFRAMNAANANAANANANANANANANANANA SRFRAMNANANANANANANANAANAANAANA DROM @ Active AAAAANAANANANANANANANA MROM @ Met-2 AAAAANAANANANANANANANA VROM @ Via-1NANANANANANANANAANAANAANA FIFONANANANAANAANAARNAARNAARNA CAMNANANANAANAANAARNAANAARNA HCSPSRAMNANANANAANANANAARNAANAARNA HCVROM @ Via-1NANANANAANANANAARNAANAARNA...

Open the catalog to page 33

SAMSUNG SEMICONDUCTOR,INC. SEPTEMBER 2006BR-06-ALL-002 BR-06-ALL-002 >

Open the catalog to page 34

CG DC/DC C P NSCROM C.CGRAM C.I BVDD VV M.VTP S6A003180810160 (254)80 (2)8-Apr2.4~5.56Au bump chip S6A0032801610160 (254)80 (2)8-Apr2.4~5.56Au bump chip S6A0065402.7~5.513Bare die/64QFP S6A0069401610080 (236)512 (8)8-Apr2.7~5.513Bare die/80QFP S6A007080168320 (224)512 (8)8-Apr2.7~5.510Bare die/Au bump chip S6A007160328400 (240)512 (8)8-Apr2.4~5.5132Au bump chip/TCP S6A007240169600 (240)160 (4)8-Apr2.7~5.511Au bump chip S6A007360349600 (240)512 (8)4-Jan2.7~5.5132~3Bare die S6A007480349600 (240)512 (8)4-Jan2.7~5.5132~3Bare die S6A0075100349600 (240)512 (8)4-Jan2.7~5.5132~3Bare die S6A0078120349600...

Open the catalog to page 35

DC/DC C D NSCC DDDRAM BVDD VV M.VTP S6B33A1132160256/4k266,1121.8~3.620VAu bump chip S6B33A2128129256/4k196,6081.8~3.320VAu bump chip S6B33B0144177256/4k/65k405,5041.8~3.320VAu bump chip S6B3300*10480256/4k99,8401.8~3.315VAu bump chip > NOTESDees aed t an astes () ae nde deeent.TCP (Tae Cae Paae) Bae de s eaent te t ae ,eet de. COF (C On F) s aaae n ase TCP. PB M AV NRGBG C DRAMVCVM.VP S6D0110132176260K132*18*1762.5~3.325V MaxAu bumped chip S6D0114132176260K132*18*1762.5~3.325V MaxAu bumped chip S6D0117132132260K132*132*182.5~3.325V MaxAu bumped chip S6D0118176240260K176*18*2402.5~3.325V MaxAu...

Open the catalog to page 36

PAGE MONITOR/INDUSTRIAL LCD PANELS 15",17" > 3c3c 4c 4c5c5c6c6c7c 8c9c 19" 20.1",21.3" 22.0",23.0",24.0",30.0" LCD TV/A.V. HD 23",26",32",40",46" FULLHD 40",46,52Ԕ,57 MOBILE PHONES MAIN DISPLAYS MAIN + EXTERNAL DISPLAYS INFORMATIONDISPLAYS 40",46",57",82" DIGITAL IMAGING:ENTERTAINMENT DSC/DVC/PHOTO PRINTERS/PMP/VOIP/GAMES MOBILE AV MINI PCS/CNS/CAR TVS/P-DVDS/ INDUSTRIAL APPLICATIONS > BR-06-ALL-003 size="-2">

Open the catalog to page 45

NOTESVen Ane (H/V)PVA-178/178,S-PVA-180/180G/G - Ga t a esnse te Te seatns eesent te an de ea dt and ae set t ane tt nte. > NOTESVen Ane (H/V)PVA-178/178,S-PVA-180/180G/G - Ga t a esnse teTe seatns eesent te an de ea dt and ae set t ane tt nte. >

Open the catalog to page 48

All Product Selection Guide

All Product Selection Guide

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