Metal Foil on Ceramic Chip Resistors
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Resistors Metal Foil on Ceramic Chip Resistors MFC Series Small size down to 0402 Tolerance to ±0.5% TCR to ±50ppm/°C High power density AEC-Q200 qualified (excluding 0.5% tolerance) All parts are Pb-free and comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3) Electrical Data Resistance range Wrap-around terminations (3 faces) Construction ively deposited on a 96% alumina substrate together with metallic contacts at each end of the resistor. Metal foil resistor material is bonded onto an alumina substrate and connected to wraparound terminations with nickel barrier and 100% Sn finish. Protecheat treated to giveare applied and each resistor isand stability, then a precisely controlled laser trim process adjusts tion and marking the required TCR measured immediately before packing into tape. protection is applied and wrap-around terminations are added and plated with Nickel then Tin. Each Marking iately before packing not marked. Larger MFC sizes are marked with 2, 3 or 4 characters indicating ohmic value. Where “R” is used it indicates the decimal into tape. MFC0402 parts are point location for the value in ohms, e.g. “R047” = 47mΩ, “R01” = 10mΩ. Where “R” is omitted, the value is in milliohms e.g. “047” = 47mΩ, “03” = 3mΩ. Reels are marked with type, value, tolerance, date code and quantity. 100% Sn matte plated wrap-around suitable for soldering. SnPb plated option is available for standard Solvent Resistance ed range below.protection and marking are resistant to all normal industrial cleaning solvents suitable for printed circuits. The body Data - Standard Range General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. BI Technologies IRC Welwyn www.ttelectronics.com/r

Metal Foil on Ceramic Chip Resistors MFC Series Performance Data Test Operational Life Short Term Overload 1000 hours, steady state, TA=125°C at de-rated power Pr<2W; 5 x Pr for 5 seconds Pr=2W; 4 x Pr for 5 seconds Biased Humidity High Temperature Exposure -55°C, 45 mins Pr, 15 mins no load 1.42 x max operating voltage for 1 minute Operation at Low Temperature Temperature Rapid Change Voltage Proof Board Flex Solderability High Pulse Double-Sided MIL-STD-202 Method 210 JIS-S-5201-1 4.18 Chip Leaching Resistors IEC-60068-2-58 8.2.1 Resistance to Solder Heat HDSC to Solvents ResistanceSeries...

Low temperature storage (1000 hours at -55°C) Substrate bending (board 1.6mm, fulcrum spacing 90mm, deflection 2mm) Insulation Ceramic resistance (1 minute @ 100Vdc) Metal Foil on Chip Foil on Thermal Chip Resistors Metal Resistors CeramicPerformance & Mounting MFC Series Temperature Derating Resistance Value Mounting Recommendations 40% 0402 Size Typical Temperature Rise Temperature Rise (°C) MFC0402 is packed on 8mm paper tape at 2mm component pitch. MFC0603, 0805 & 1206 are packed on 8mm paper tape at 4mm component pitch. MFC2010 & 2512 are packed on 12mm plastic tape at 4mm component...